The invention relates to a square cutting, edge cutting and polishing all-in-one machine, and belongs to the technical field of crystalline silicon machining equipment. The all-in-one machine comprises a base, wherein a sliding rail is arranged on the base, a feeding workbench mechanism, a centering mechanism, a squaring mechanism, a scrap edge falling mechanism and at least two polishing mechanisms are sequentially arranged on the sliding rail along the conveying direction of crystalline silicon, the feeding workbench mechanism is used for bearing the crystalline silicon and driving the crystalline silicon to move along the sliding rail, cutting lines bypass a squaring net of the squaring mechanism and form parallel lines, the scrap edge falling mechanism is used for sucking scrap edges generated under the cutting of the squaring mechanism, and the at least two polishing mechanisms are symmetrically arranged along the sliding rail. According to the all-in-one machine, the squaring mechanism and the polishing mechanism are integrated into one, and the crystal silicon can directly enter the slicing process after being machined at one time; the squaring mechanism adopts a form of two-wire squaring, so that cutting the crystal silicon into square bars and removing edges and corners are realized, the grinding allowance of the grinding procedure is reduced, and the rough grinding procedure is omitted; and a crystal bar is subjected to edge and corner machining immediately following one-time polishing after cut into the square bars, so that the grinding efficiency is remarkably improved.