Square cutting, edge cutting and polishing all-in-one machine

Abstract

The invention relates to a square cutting, edge cutting and polishing all-in-one machine, and belongs to the technical field of crystalline silicon machining equipment. The all-in-one machine comprises a base, wherein a sliding rail is arranged on the base, a feeding workbench mechanism, a centering mechanism, a squaring mechanism, a scrap edge falling mechanism and at least two polishing mechanisms are sequentially arranged on the sliding rail along the conveying direction of crystalline silicon, the feeding workbench mechanism is used for bearing the crystalline silicon and driving the crystalline silicon to move along the sliding rail, cutting lines bypass a squaring net of the squaring mechanism and form parallel lines, the scrap edge falling mechanism is used for sucking scrap edges generated under the cutting of the squaring mechanism, and the at least two polishing mechanisms are symmetrically arranged along the sliding rail. According to the all-in-one machine, the squaring mechanism and the polishing mechanism are integrated into one, and the crystal silicon can directly enter the slicing process after being machined at one time; the squaring mechanism adopts a form of two-wire squaring, so that cutting the crystal silicon into square bars and removing edges and corners are realized, the grinding allowance of the grinding procedure is reduced, and the rough grinding procedure is omitted; and a crystal bar is subjected to edge and corner machining immediately following one-time polishing after cut into the square bars, so that the grinding efficiency is remarkably improved.

Description

Technical field [0001] The invention belongs to the technical field of crystalline silicon processing equipment, and specifically relates to an integrated machine for cutting square cutting edge grinding and polishing. Background technique [0002] The manufacturing process of silicon wafers used in the production of solar panels is divided into several steps: crystal pulling, cutting, square extraction, grinding, and slicing. Crystal pulling is to generate cylindrical single crystal silicon rods by chemical deposition in a crystal pulling furnace with a length of up to 6 meters; truncation refers to cutting the pulled single crystal silicon rods into different lengths (100~700mm ); square rooting refers to cutting the truncated single crystal silicon rods of different lengths into a rectangular parallelepiped shape; grinding down refers to grinding and polishing the four surfaces of the rectangular parallelepiped silicon single crystal rods with an abrasive tool, and The proces...

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Problems solved by technology

[0003] At present, the cutting machines, square cutting machines, and grinding and polishing machines used in the market all process the bars with a single machine, and then manually transport them to another equipment for processing. It is necessary to frequently adjust the position of the bar and the bar, which is very inconvenient to operate. Moreover, the labor intensity is high and a large number of operators are required; with the continuous improvement of photovoltaic crystal pulling technology, the processing quality and efficiency of cutting, cutting, and grinding equipment are also getting higher and higher, and the dimensional accuracy error of the square root can be improved from ±0.3mm To within ±0.1mm, the size difference is 0.05-0.1mm, which is just the fine grinding allowance, which can save a lot of grinding amount for the next grinding process

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