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Diamond grinding plate used for accurately grinding double end surfaces of sapphire and manufacturing method of diamond grinding plate

A diamond and double-end technology is applied in the field of diamond grinding discs for sapphire double-end fine grinding and its production, which can solve the problems of inability to improve processing efficiency, deep texture of sapphire slices, scratches, etc.

Active Publication Date: 2016-10-12
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The rough grinding process has high processing efficiency, but the sapphire sheet after rough grinding has deep texture, and direct rough polishing cannot achieve the result of improving processing efficiency. Therefore, if the processing efficiency and surface quality of finishing can be improved, and the thickness of the damaged layer can be reduced, the The processing efficiency will be greatly improved
[0005] At present, the fine grinding of sapphire is due to the use of micropowder grade SiC or B 4 C, its processing efficiency is less than 0.02mm / h, and there will be defects such as scratches during processing

Method used

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  • Diamond grinding plate used for accurately grinding double end surfaces of sapphire and manufacturing method of diamond grinding plate
  • Diamond grinding plate used for accurately grinding double end surfaces of sapphire and manufacturing method of diamond grinding plate
  • Diamond grinding plate used for accurately grinding double end surfaces of sapphire and manufacturing method of diamond grinding plate

Examples

Experimental program
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Effect test

Embodiment 1

[0033] A diamond grinding disc for fine grinding double-end faces of sapphire, comprising a metal substrate and a diamond grinding layer on the metal substrate, wherein the diamond grinding layer is made of the following raw materials in parts by weight: 20~ 50. 20~30 of white corundum micropowder with a particle size of 1~10 μm, 3~5 of cerium oxide, 15~30 of vitrified bond, 2~5 of bentonite, 4~10 of starch and 20~40 of water; the vitrified bond is made of The following raw materials are prepared by mixing lead oxide, albite, boron glass and quartz in a ratio of 1: (1~5): (4~15): (4~25).

[0034] The above-mentioned manufacturing method of the diamond grinding disc for the fine grinding of the double-end sapphire comprises the following steps:

[0035] (1) Ingredients: Weigh diamond micropowder, white corundum micropowder, cerium oxide, vitrified binder, bentonite, starch and water according to the above ratio, mix them and pass through a 120-200 mesh sieve to obtain a slurry;...

Embodiment 2

[0044] A diamond grinding disc for fine grinding double-end faces of sapphire, wherein the diamond grinding layer is made of the following raw materials in parts by weight: diamond micropowder 30 with a particle size of 1-10 μm, white corundum micropowder 20 with a particle size of 1-10 μm, cerium oxide 5. Vitrified binder 20, bentonite 4, starch 5 and water 30; the vitrified binder is mixed with the following raw materials lead oxide, albite, boron glass and quartz in a ratio of 1:2:5:10 Prepared.

[0045] The preparation method of this embodiment is the same as that of Example 1.

Embodiment 3

[0047] A diamond grinding disc for fine grinding double-end faces of sapphire, wherein the diamond grinding layer is made of the following raw materials in parts by weight: diamond micropowder 20 with a particle size of 1-10 μm, white corundum micropowder 30 with a particle size of 1-10 μm, cerium oxide 4. Vitrified binder 20, bentonite 2, starch 6 and water 20; the vitrified binder is mixed with the following raw materials lead oxide, albite, boron glass and quartz in a ratio of 1:2:8:15 Prepared.

[0048] The preparation method of this embodiment is the same as that of Example 1.

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Abstract

The invention relates to a diamond grinding plate used for accurately grinding the double end surfaces of a sapphire and a manufacturing method of the diamond grinding plate. The diamond grinding plate comprises a metal matrix and a diamond grinding layer on the metal matrix. The diamond grinding layer is made of, by weight, 20-50 pats of diamond micro powder with the particle size being 1-10 [mu]m, 20-30 pats of white corundum micro powder with the particle size being 1-10 [mu]m, 3-5 parts of cerium oxide, 15-30 parts of a ceramic binder, 2-5 parts of bentonite, 4-10 pats of starch and 20-40 pats of water. The ceramic binder is formed by mixing lead oxide, sodium feldspar, boron glass and quartz at the ratio of 1:(1-5):(4-15):(4-25). According to the manufactured diamond grinding plate used for accurately grinding the double end surfaces of the sapphire, the high water permeability can be kept through the grinding layer; the purposes of grinding removing and continuous self sharpness are achieved due to the fact that water permeates outwards inside the grinding plate while grinding is conducted; the machining efficiency of the double end surfaces of the sapphire is improved; and the high surface quality can be ensured.

Description

technical field [0001] The invention belongs to the technical field of superabrasive tools, and is mainly used for double-end processing of sapphire used for electronic devices, clocks, optical parts and window materials, and in particular relates to a diamond grinding disc for precise grinding of sapphire double-end surfaces and a manufacturing method thereof. Background technique [0002] The sapphire material is more and more widely used in watch mirrors, electronic devices, and optical materials, and the grinding process of its double ends is an essential process. However, the chemical properties of sapphire are stable, and the physical hardness can reach 9 on the Mohs scale, so grinding is very difficult. The biggest problem with the current double-face processing is the low processing efficiency, which greatly increases the cost of sapphire. [0003] At present, the double-face grinding of sapphire windows is mainly divided into rough grinding, fine grinding, rough po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/14B24D3/34B24D18/00C04B35/52C04B35/636
CPCB24D3/14B24D3/34B24D3/342B24D18/009C04B35/52C04B35/636C04B2235/3217C04B2235/3229C04B2235/3296C04B2235/3418C04B2235/3472C04B2235/349C04B2235/365
Inventor 苏鸿良郜永娟赵秀香
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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