Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of foot-shape imitated gecko adhesion material

A strip and sheet technology is applied in the field of preparation of foot-shaped gecko-like adhesive materials, which can solve problems such as difficulty in processing microporous array molds, and achieve the effects of reducing production costs, simple process, and strong controllability.

Inactive Publication Date: 2019-10-22
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
View PDF11 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the technical problem that it is difficult to process microhole array molds with complex shapes and high aspect ratios in the prior art, and provide a mold with foot-shaped imitation gecko adhesive materials and its preparation method and application. Starting from the side profile design and processing of adhesive fibers, the controllable molding of fiber array materials with different adhesion characteristics can be realized, and the manufacturing method can realize the preparation of array structures with complex shapes, and has the advantages of easy demoulding and reusable molds. Advantage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of foot-shape imitated gecko adhesion material
  • Preparation method of foot-shape imitated gecko adhesion material
  • Preparation method of foot-shape imitated gecko adhesion material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The cross-sectional view and specific dimensions of the fiber unit of the foot-shaped imitation gecko adhesive material designed in this embodiment are as follows: figure 1 shown. Specifically, the structure of the fiber unit has both a rectangular cross-section and a foot-like longitudinal section, and the simultaneous having a rectangular cross-section and a foot-like longitudinal section refers to the shape of the fiber unit. Such as figure 2 As shown, the transverse section refers to the plane parallel to xy, which is a profile with rectangular features; the longitudinal section refers to the plane parallel to xz, which is the complex shape profile of the fiber that can be designed.

[0029] The lamellar assembly silicon mold used in the preparation method of the foot-shaped imitation gecko adhesive material is formed by directional bonding and assembly of n silicon sheets with corresponding microstructure etching grooves, where n=required mold Overall width / thic...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparation method of a foot-shape imitated gecko adhesion material. The foot-shaped imitated gecko-like adhesion material is obtained by pouring a liquid high-molecular polymer into a sheet-laminated assembled silicon mold, curing, and separating the cured high-molecular polymer from the mold. The sheet-laminated assembled silicon mold is assembled by directionally laminating at least two silicon sheets with corresponding microstructure etching grooves in parallel. The method is directly designed and processed from a side surface contour design of adhesive fibers, the fiber array materials with different adhesion characteristics can be controlled and formed,the manufacturing method is capable of realizing the preparation of an array structure with a complicated morphology, and has the advantages of easiness in demolding and reusability of the mold.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing, and in particular relates to a preparation method of a foot-like imitation gecko adhesive material. Background technique [0002] Geckos in nature have the ability to move over the eaves and walls, which is due to the structural mechanical properties of "strong adhesion / easy detachment" of their feet. This adhesion characteristic comes from the micro-nano scale of gecko feet setae array. This bristle array can greatly increase the actual contact area with the target surface, thereby converging the intermolecular van der Waals force, generating macroscopic adhesion, and providing a mechanical basis for geckos to move on a wide range of object surfaces. In 2000, American scientists Autumn et al. used MEMS cantilever beam sensors to measure the adhesion force of a single gecko setae, and demonstrated for the first time the anisotropic adhesion characteristics of gecko setae with ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B29C33/38B29C33/42B29C39/02B29C39/26
CPCB29C33/3842B29C33/424B29C39/02B29C39/26
Inventor 姬科举戴振东唐义强吴杰崔恩华陈健
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com