Manufacturing method of heat dissipation structure
A technology of a heat dissipation structure and a manufacturing method, which can be applied to coatings and other directions, can solve the problems of heavy weight and high manufacturing cost, and achieve the effects of reducing manufacturing cost, reducing weight, and enhancing heat dissipation effect.
Inactive Publication Date: 2019-10-25
陆文聪 +1
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Problems solved by technology
In the prior art, the heat dissipation structure is generally made of metal, which is relatively heavy, and the production cost is high, so it is not suitable for some electronic products that require high weight.
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[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0024] figure 1 It is a flowchart of a method for manufacturing a heat dissipation structure in an embodiment of the present invention, and the method for manufacturing a heat dissipation structure includes the following steps:
[0025] S110, sending the aluminum liquid into an extrusion die to extrude aluminum to form a semi-finished product for heat dissipation. Wherein, the aluminum liquid can be formed by melting and casting LA-6063-T5 aluminum ingot. Sp...
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Abstract
The invention discloses a manufacturing method of a heat dissipation structure. The manufacturing method comprises the following steps that molten aluminum is sent into an extrusion die to extrude aluminum to form a heat dissipation semi-finished product; a connecting hole is formed in the surface of the heat dissipation semi-finished product; the heat dissipation semi-finished product is placed in a bakelite injection die, a graphene-polymer alloy is injected on the surface of the heat dissipation semi-finished product, so that the graphene-polymer alloy enters the connecting hole; and cooling and solidifying are conducted, so that the heat dissipation structure is formed. According to the manufacturing method of the heat dissipation structure, the extruded aluminum and the graphene-polymer alloy material are combined together through an injection molding process, so that the manufacturing cost can be reduced, the weight can be reduced, and meanwhile, the heat dissipation effect is enhanced.
Description
technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a method for manufacturing a heat dissipation structure. Background technique [0002] As the performance of various electronic products becomes stronger and stronger, the internal chips also provide more and more efficient execution speeds, and the heat generated inside them is also higher and higher. In order to avoid burning the chips, it is necessary for the heat dissipation structure to It is heat-dissipated. In the prior art, the heat dissipation structure is generally made of metal, which is relatively heavy and has high manufacturing costs, which is not suitable for some electronic products that require high weight. Contents of the invention [0003] The object of the present invention is to provide a method for manufacturing a heat dissipation structure, which can reduce the manufacturing cost and weight, and enhance the heat dissipation effect at the same ti...
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IPC IPC(8): B29C45/14B21C23/02B29K705/02
CPCB21C23/02B29C45/1418B29C45/14344B29C2045/14245B29K2705/02
Inventor 陆文聪刘玉颖
Owner 陆文聪