High-thermal conductivity copper-clad-plate adhesive glue

A technology for adhesive and copper clad laminates, applied in the field of adhesives, can solve the problems of low thermal conductivity, high cost, poor performance, etc., and achieve the effects of improving economic benefits, strict ratio and reducing production costs

Inactive Publication Date: 2019-10-25
TIANCHANG JINGFA ALUMINUM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The connection between copper-clad laminates also depends on adhesive glue; the adhesive glue for copper-clad laminates currently on the market has high cost, poor performance, and low thermal conductivity, which cannot meet the needs of production and use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Take 15% epoxy resin, 10% DMF, 15% acetone, 58% aluminum oxide and 2% dipolycyanamide according to the mass percentage for subsequent use;

[0032] (2) Epoxy resin is added in stirring equipment, start to stir, in stirring process, add DMF and acetone successively in stirring equipment, stirring time is 30min, make epoxy resin diluent after stirring;

[0033] (3) Aluminum oxide is added in the epoxy resin diluent made in step 2, stir evenly, then add dipolycyanamide, stirring time is 100min, stir to make adhesive mixture;

[0034] (4) Put the adhesive mixture prepared in step 3 into the defoaming equipment for defoaming treatment, vacuumize while stirring, and vacuum for 20 minutes, stir evenly without air bubbles to obtain a high thermal conductivity adhesive product.

[0035] The obtained high thermal conductivity adhesive has a viscosity of 3029cps at 25°C, an elastic modulus of 46MPa at 23°C, a curing shrinkage rate of 0.3%, and a thermal conductivity of 5.30W / (...

Embodiment 2

[0037] (1) Take 20% epoxy resin, 9% DMF, 13% acetone, 57% aluminum oxide and 1% dipolycyanamide according to the mass percentage for subsequent use;

[0038] (2) Epoxy resin is added in stirring equipment, start to stir, in stirring process, add DMF and acetone successively in stirring equipment, stirring time is 30min, make epoxy resin diluent after stirring;

[0039] (3) Aluminum oxide is added in the epoxy resin diluent made in step 2, stir evenly, then add dipolycyanamide, stirring time is 100min, stir to make adhesive mixture;

[0040] (4) Put the adhesive mixture prepared in step 3 into the defoaming equipment for defoaming treatment, vacuumize while stirring, and vacuum for 20 minutes, stir evenly without air bubbles to obtain a high thermal conductivity adhesive product.

[0041] The resulting high thermal conductivity adhesive has a viscosity of 3219cps at 25°C, an elastic modulus of 48MPa at 23°C, a curing shrinkage rate of 0.4%, and a thermal conductivity of 5.62W / (...

Embodiment 3

[0043] (1) Take by weighing 22% epoxy resin, 9% DMF, 12% acetone, 56.5% aluminum oxide and 0.5% dipolycyanamide for subsequent use according to mass percentage;

[0044] (2) Epoxy resin is added in stirring equipment, start to stir, in stirring process, add DMF and acetone successively in stirring equipment, stirring time is 30min, make epoxy resin diluent after stirring;

[0045] (3) Aluminum oxide is added in the epoxy resin diluent made in step 2, stir evenly, then add dipolycyanamide, stirring time is 100min, stir to make adhesive mixture;

[0046] (4) Put the adhesive mixture prepared in step 3 into the defoaming equipment for defoaming treatment, vacuumize while stirring, and vacuum for 20 minutes, stir evenly without air bubbles to obtain a high thermal conductivity adhesive product.

[0047] The obtained high thermal conductivity adhesive has a viscosity of 3286cps at 25°C, an elastic modulus of 49.2MPa at 23°C, a curing shrinkage rate of 0.52%, and a thermal conductiv...

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PUM

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Abstract

The invention relates to the technical field of adhesive glue, in particular to high-thermal conductivity copper-clad-plate adhesive glue. The raw materials of the adhesive glue comprises the following components: in percent by mass, 10-30% of epoxy resin, 5-15% of DMF, 6-20% of acetone, 30-60% of alumina and 0-2% of dicyandiamide. The deficiencies in the prior art are overcome, the thermal conductivity and curing speed of the adhesive glue are improved, the production cost is reduced, the economic benefit of enterprises is improved, and requirements of production and application are met, so that a high promotion value is achieved.

Description

technical field [0001] The invention relates to the technical field of adhesive adhesives, in particular to an adhesive adhesive for copper-clad laminates with high thermal conductivity. Background technique [0002] Adhesives and adhesives are the general term for non-metallic materials that can combine one solid surface with another solid surface due to surface bonding and internal forces (adhesion and cohesion, etc.). [0003] Copper clad laminate (also known as substrate). The reinforcing material is impregnated with resin, one or both sides are covered with copper foil, and a plate-shaped material is formed by hot pressing, which is called copper-clad laminate. The connection between copper clad laminates is also connected by adhesive glue; the adhesive glue for copper clad laminates currently on the market has high cost, poor performance, and low thermal conductivity, which cannot meet the needs of production and use. Contents of the invention [0004] The purpose ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/40
CPCC09J163/00C09J11/04C08G59/4021C08K2003/2227C08K3/22
Inventor 俞金法
Owner TIANCHANG JINGFA ALUMINUM IND
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