Winding device of lead frame electroplating production line

Abstract

The invention relates to a winding device of a lead frame electroplating production line. The winding device of the lead frame electroplating production line comprises a rack (1). The top of the rightend of the rack (1) is provided with two first supporting frames (2). The outer sides of the first supporting frames (2) are provided with winding disks (3). The tops of the first supporting frames (2) are provided with PP film discharging taking-up devices (4). The PP film discharging taking-up devices (4) are provided with PP film discharging disks (5) in a penetrated manner. PP film fracture detecting sensors (6) are arranged between the PP film discharging disks (5) and the winding disks (3). Steering disks (7) are arranged on the lower left portions of the winding disks (3). Two limitingdevices (8) are arranged on the right of the steering disks (7). A lead frame semi-finished product fracture detecting sensor (9) is arranged between the limiting devices (8). By means of the windingdevice of the lead frame electroplating production line, the problem that an existing PP film and a supporting rod rub each other, and consequently sweeps are generated and pollute a lead frame can be solved.

Description

technical field [0001] The invention relates to a winding device of a lead frame electroplating production line, belonging to the technical field of lead frame production equipment. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] A method for manufacturing a lead frame disclosed in patent CN 102983083B mainly includes the following steps: [0004] A) stamping step: take the copper alloy sheet, and stamp it through the convex and concave dies of the blanking die to form a lead frame ...

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a lead frame electroplating production line winding device for the above-mentioned prior art, which can solve the problem of the lead frame caused by the easy friction between the PP film inner ring and the support rod in the existing PP film unwinding device. The problem of semi-finished products being polluted by friction waste

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