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Winding device of lead frame electroplating production line

An electroplating production line and lead frame technology, which is applied in the directions of coiling strips, transportation and packaging, thin material processing, etc., can solve the problems of lead frame semi-finished product pollution, etc., and achieve the effects of improving the material receiving effect, convenient operation, and increasing the tension of feeding Effect

Pending Publication Date: 2019-11-01
JIANGYIN KANGQIANG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a lead frame electroplating production line winding device for the above-mentioned prior art, which can solve the problem of the lead frame caused by the easy friction between the PP film inner ring and the support rod in the existing PP film unwinding device. The problem of semi-finished products being polluted by friction waste

Method used

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  • Winding device of lead frame electroplating production line
  • Winding device of lead frame electroplating production line
  • Winding device of lead frame electroplating production line

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Embodiment Construction

[0075] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0076] Such as Figure 1 to Figure 10 As shown, a lead frame electroplating production line winding device in this embodiment includes a frame 1, and two first support frames 2 are arranged on the top of the right end of the frame 1. The outer side of each is provided with a winding reel 3, and the top of the first support frame 2 is provided with a PP film unwinding elastic device 4, and the PP film unwinding elastic device 4 is equipped with a PP film unwinding disc 5, and the A PP film break detection sensor 6 is arranged between the PP film discharge tray 5 and the take-up reel 3, a steering wheel 7 is arranged on the lower left side of the take-up reel 3, and two left and right parallel arrangements are arranged on the right side of the steering wheel 7. The limit device 8, the lead frame semi-finished product fracture detection sensor 9...

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Abstract

The invention relates to a winding device of a lead frame electroplating production line. The winding device of the lead frame electroplating production line comprises a rack (1). The top of the rightend of the rack (1) is provided with two first supporting frames (2). The outer sides of the first supporting frames (2) are provided with winding disks (3). The tops of the first supporting frames (2) are provided with PP film discharging taking-up devices (4). The PP film discharging taking-up devices (4) are provided with PP film discharging disks (5) in a penetrated manner. PP film fracture detecting sensors (6) are arranged between the PP film discharging disks (5) and the winding disks (3). Steering disks (7) are arranged on the lower left portions of the winding disks (3). Two limitingdevices (8) are arranged on the right of the steering disks (7). A lead frame semi-finished product fracture detecting sensor (9) is arranged between the limiting devices (8). By means of the windingdevice of the lead frame electroplating production line, the problem that an existing PP film and a supporting rod rub each other, and consequently sweeps are generated and pollute a lead frame can be solved.

Description

technical field [0001] The invention relates to a winding device of a lead frame electroplating production line, belonging to the technical field of lead frame production equipment. Background technique [0002] As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to the bridge function of connecting with external wires, most semiconductor integrated blocks need to use lead frames, which are important basic materials in the electronic information industry. [0003] A method for manufacturing a lead frame disclosed in patent CN 102983083B mainly includes the following steps: [0004] A) stamping step: take the copper alloy sheet, and stamp it through the convex and concave dies of the blanking die to form a lead frame ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65H23/26B65H26/00
CPCB65H23/26B65H26/00
Inventor 孙华裘培明孙宜腾
Owner JIANGYIN KANGQIANG ELECTRONICS
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