Thermal vacuum forming system for 3D glass

A heat forming and glass technology, which is applied in glass forming, glass reshaping, glass manufacturing equipment, etc., can solve the problems of low yield rate, low efficiency, high cost, etc., to improve yield rate, reduce energy consumption, and reduce stress Effect

Pending Publication Date: 2019-11-01
湖南三兴精密工业股份有限公司
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] In order to overcome the technical problems of low yield rate, high cost and low efficiency of the current 3D glass forming process equipment, the present invention provides a 3D glass heat absorption forming system with simple structure, low cost, high production efficiency and low energy consumption

Method used

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  • Thermal vacuum forming system for 3D glass
  • Thermal vacuum forming system for 3D glass
  • Thermal vacuum forming system for 3D glass

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Embodiment Construction

[0034] see figure 2 , the heating mold used in this embodiment is only provided with a lower die, and the lower die is provided with a groove for accommodating the glass to be processed, and the bottom of the groove is made of a breathable microporous material. In order to ensure the effect of heat absorption processing, the microporous material used is a high-temperature stable thermally conductive microporous material, such as graphite or other similar graphite with micropores, high thermal conductivity, and high temperature stability, such as silicon carbide.

[0035] see image 3 , this embodiment includes a frame, a heating and forming furnace chamber mechanism, a vacuum forming mechanism and a heating mold; to vacuumize; the heating and forming furnace cavity mechanism includes a heating furnace body, which is arranged on the frame, and there is a cavity in the center of the heating furnace body for the heating mold to pass through, and there are inlets for the mold to...

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Abstract

A thermal vacuum forming system for 3D glass is disclosed, including a rack, a thermoforming furnace chamber mechanism, a vacuum forming mechanism and a heating mold, wherein the thermoforming furnacechamber mechanism is arranged on the rack, and the vacuum forming mechanism is below the rack and is connected to the thermoforming furnace chamber mechanism to perform vacuumization. Technical effects of the system are that: a vacuum forming technique is adopted for glass panel processing, suction pressure is uniform, stress is small and a pressurization dead angle is avoided; the product yieldis effectively increased; a polishing step for subsequent 3D glass processing is omitted and various complex curved surfaces can be formed. The chamber adopts a structure having a shape like a hollowsquare which is encircled with another hollow square, and the wall of the chamber is lined with a high-temperature resistant heat insulation material, thus effectively maintaining the internal temperature of the chamber, reducing loss of heat energy and reducing energy consumption.

Description

technical field [0001] The invention relates to a 3D glass heat absorption molding system. Background technique [0002] With the introduction of new products such as mobile phones and tablet computers, the shape of the products has also changed accordingly. In order to match the shape of the products, the market has higher and higher requirements for the glass panels covering the screens. At present, the glass panels of most products Panels are required to be made of curved 3D glass. However, the existing 3D glass forming process equipment is all hot press forming equipment, and the hot press forming adopts a molding process. figure 1 As shown; the molding process requires high temperature accuracy, and temperature changes are likely to cause defective products. Moreover, the molded type is a centrally pressurized design, which may easily cause uneven force on the periphery, indentation and other defects on the concave surface of the product, which will affect the product...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B23/035
CPCC03B23/0357
Inventor 彭富国刘光映
Owner 湖南三兴精密工业股份有限公司
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