Device for preprocessing for circuit board by adopting thermal conductivity

A thermal conductivity, circuit board technology, applied in the direction of assembling printed circuits with electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as influence, welding dislocation, etc.

Active Publication Date: 2019-11-01
河南拓普艾科技有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the basic components of many electronic devices use circuit boards, other micro-instruments need to be installed on the surface of the circuit board to complete the work. Some micro-instruments need to be drilled on the surface of the circuit board, and soldering is required after the hole is completed. , because the circuit board is a precision component, drilling and welding need to use special equipment to complete, b

Method used

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  • Device for preprocessing for circuit board by adopting thermal conductivity
  • Device for preprocessing for circuit board by adopting thermal conductivity
  • Device for preprocessing for circuit board by adopting thermal conductivity

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-4 , a device for preprocessing circuit boards by using thermal conductivity, comprising a support frame 1, the inside of the support frame 1 is movably connected with a tin liquid tank 3 through a telescopic rod 2, and the inside of the tin liquid tank 3 is fixedly connected with a housing 4, The inside of the casing 4 is movably connected with a drill bit 5, and the surface of the casing 4 is provided with an inflow port 6 on both sides o...

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Abstract

The invention relates to the technical field of circuit board processing, and discloses a device for preprocessing for a circuit board by adopting thermal conductivity. The device comprises a supportframe, the internal portion of the support frame is movably connected with a tin liquid tank through a telescopic rod, the tin liquid tank is internally fixedly connected with a shell, the internal portion of the shell is movably connected with a drill, inflow ports are arranged at two sides of the drill and at the surface of the shell, the lower portions of the inflow ports are movably connectedwith a tin injection mechanism, the tin injection mechanism comprises a spring and can generate a cyclone with the drill as the center while rotating, the cyclone can drain liquid tin in the tin liquid tank through a liquid flow channel in a screw rod, in addition, certain heat is generated due to friction of the cyclone and the liquid tin, the drained liquid tin flows to the periphery of the drilled hole of the circuit board, and cannot be solidified within short time under the action of heat generated by friction, and therefore, the instrument to be installed is adhered to the surface of thecircuit board simultaneously to achieve the effect of welding while completing the punching.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a device for preprocessing a circuit board by utilizing thermal conductivity. Background technique [0002] The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, which makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. [0003] Since the basic components of many electronic devices use circuit boards, other micro-instruments need to be installed on the surface of the circuit board to complete the work. Some micro-instruments need to be drilled on the surface of the circuit board, and soldering is required after the hole is completed. , because the circuit board is a precision component, drilling and welding need to use special equipment to complete, but in the existing equipment, the drilling and welding are ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/34
CPCH05K3/0047H05K3/34H05K2203/0214
Inventor 孔令飞
Owner 河南拓普艾科技有限公司
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