Device for preprocessing for circuit board by adopting thermal conductivity

Abstract

The invention relates to the technical field of circuit board processing, and discloses a device for preprocessing for a circuit board by adopting thermal conductivity. The device comprises a supportframe, the internal portion of the support frame is movably connected with a tin liquid tank through a telescopic rod, the tin liquid tank is internally fixedly connected with a shell, the internal portion of the shell is movably connected with a drill, inflow ports are arranged at two sides of the drill and at the surface of the shell, the lower portions of the inflow ports are movably connectedwith a tin injection mechanism, the tin injection mechanism comprises a spring and can generate a cyclone with the drill as the center while rotating, the cyclone can drain liquid tin in the tin liquid tank through a liquid flow channel in a screw rod, in addition, certain heat is generated due to friction of the cyclone and the liquid tin, the drained liquid tin flows to the periphery of the drilled hole of the circuit board, and cannot be solidified within short time under the action of heat generated by friction, and therefore, the instrument to be installed is adhered to the surface of thecircuit board simultaneously to achieve the effect of welding while completing the punching.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a device for preprocessing a circuit board by utilizing thermal conductivity. Background technique [0002] The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, which makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. [0003] Since the basic components of many electronic devices use circuit boards, other micro-instruments need to be installed on the surface of the circuit board to complete the work. Some micro-instruments need to be drilled on the surface of the circuit board, and soldering is required after the hole is completed. , because the circuit board is a precision component, drilling and welding need to use special equipment to complete, but in the existing equipment, the drilling and welding are ...

AI Technical Summary

Problems solved by technology

[0003] Since the basic components of many electronic devices use circuit boards, other micro-instruments need to be installed on the surface of the circuit board to complete the work. Some micro-instruments need to be drilled on the surface of the circuit board, and soldering is required after the hole is completed. , because the circuit board is a precision component, drilling and welding need to use special equipment to complete, but in the existing equipment, the drilling and welding are carried out step by step, because there are too many lines on the surface of the circuit board, the positioning needs to be accurate when drilling , if the secondary movement will affect the accuracy of its positioning hole, resulting in the phenomenon of welding dislocation, so a kind of equipment that uses thermal conductivity to preprocess the circuit board came into being

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