A device for preprocessing circuit boards using thermal conductivity

Abstract

The invention relates to the technical field of circuit board processing, and discloses a device for preprocessing circuit boards by using thermal conductivity, including a support frame, the inside of which is movably connected with a tin liquid tank through a telescopic rod, and the tin liquid tank The inside is fixedly connected with a shell, and the inside of the shell is movably connected with a drill bit. On the surface of the shell and on both sides of the drill bit, there are inlets. The lower part of the inlet is movably connected to a tin injection mechanism. The tin injection mechanism includes a spring and rotates At the same time, a whirlwind centered on the drill bit will be generated. The whirlwind will drain the liquid tin in the tin liquid tank through the liquid flow channel in the screw. In addition, due to the friction between the two, a certain amount of heat will be generated, and the liquid tin will flow to the circuit. Around the drilled hole, under the action of heat generated by friction, it will not solidify in a short period of time. During this time, the instrument to be installed can be bonded to the surface of the circuit board, thus achieving the effect of welding while the drilling is completed.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a device for preprocessing a circuit board by utilizing thermal conductivity. Background technique [0002] The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, which makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances. [0003] Since the basic components of many electronic devices use circuit boards, other micro-instruments need to be installed on the surface of the circuit board to complete the work. Some micro-instruments need to be drilled on the surface of the circuit board, and soldering is required after the hole is completed. , because the circuit board is a precision component, drilling and welding need to use special equipment to complete, but in the existing equipment, the drilling and welding are ...

AI Technical Summary

Problems solved by technology

[0003] Since the basic components of many electronic devices use circuit boards, other micro-instruments need to be installed on the surface of the circuit board to complete the work. Some micro-instruments need to be drilled on the surface of the circuit board, and soldering is required after the hole is completed. , because the circuit board is a precision component, drilling and welding need to use special equipment to complete, but in the existing equipment, the drilling and welding are carried out step by step, because there are too many lines on the surface of the circuit board, the positioning needs to be accurate when drilling , if the secondary movement will affect the accuracy of its positioning hole, resulting in the phenomenon of welding dislocation, so a kind of equipment that uses thermal conductivity to preprocess the circuit board came into being

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