Automatic flipping semiconductor cleavage device and processing method

Abstract

The invention relates to an automatic flip-type semiconductor cleavage device and a processing method. The device is composed of a tablet press and a dicing machine. A rotating shaft is connected between the upper ends of the support plates on both sides of the workbench of the tablet machine. The rotating shaft passes through two The rod on the side is connected to both sides of the table of the dicing machine, one end of the rotating shaft is connected to the stepping motor, and the other end is connected to the angle sensor; the bottom of the table of the dicing machine is closely attached to the fixed shaft through a semicircular groove Form the required clamping force of the workbench of the dicing machine; The workbench of the dicing machine and the workbench of the dicing machine are respectively provided with a pressing suction cup and a dicing suction cup; the steps of the method are: the wafer is placed on Align and absorb on the scribing suction cup, clamp the scribing table, and then complete the scribing; then when the scribing table is turned 150 degrees to the direction of the sheet pressing table, release the wafer on the suction cup; and then monitor in real time through the CCD camera Whether the wafer is aligned and adsorbed by the wafer chuck; finally remove the cracked wafer from the wafer chuck and set it aside.

Description

technical field [0001] The invention relates to a semiconductor cleavage device, in particular to an automatic flip semiconductor cleavage device and a processing method. Background technique [0002] At present, the processing methods used for dicing and fracturing of wafers in China are all completed on their respective scribing and pressing workbenches, that is, the wafers are first placed on the scribing plate on the dicing machine workbench and then scribing is completed. , and then turn the diced wafer on the pneumatic vacuum chuck on the table of the tablet press for fracturing, so that the efficiency of back and forth scribing is very low, and the table of the dicing machine and the table of the tablet press are not compact , takes up a lot of space. Therefore, it is necessary to conceive an automatic flipping semiconductor cleavage processing method that can not only improve the efficiency of dicing and fracturing wafers, but also make the dicing machine workbench ...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of cutting and fracturing wafers in China. The processing methods used are all completed on separate scribing and pressing workbenches, which leads to low efficiency of scribing and fracturing wafers, and dicing The workbench of the tablet machine and the tabletting machine are not compact in structure and take up a lot of space, and provide an automatic flip-type semiconductor cleavage that can improve the efficiency of scribing and pressing wafers, and the workbench of the scribing machine has a compact structure and takes up little space. Device and processing method

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