Heat dissipation silica gel mounting device for computer mainboard chip

Abstract

The invention provides a heat dissipation silica gel mounting device for a computer mainboard chip. The device comprises a chip mounter frame. A carrying mechanism is arranged at the inner bottom of the chip mounter frame. A material guide bin is arranged above the carrying mechanism. The top end and the bottom end of the material guide bin are each of an open structure. A limiting block is arranged on the inner circumferential face of the bottom end of the material guide bin. A limiting piece is arranged on the outer circumferential face of the top end of the material guide bin. A feeding binis sleeved with the guiding bin. The top end and the bottom end of the feeding bin are each of an open structure. The bottom end of the feeding bin is clamped to the limiting block. A glue spraying bin is arranged on the outer circumferential face of the lower end of the material guiding bin. A plurality of glue spraying nozzles are arranged on the lower portion of the glue spraying bin. A glue applicator is arranged at the top of the mounting rack. The glue applicator is connected with the glue spraying bin through a glue conveying pipeline. A glue conveying pump is arranged between the upper end of the glue conveying pipeline and the glue applicator. The heat dissipation silica gel in the feeding bin is conveyed to the lower stage through the grading push plug, so that the heat dissipation silica gel is attached to the back face of the computer mainboard chip. The efficiency of attaching the heat dissipation silica gel to the computer mainboard chip is greatly improved.

Description

technical field [0001] The invention relates to a mounting device, in particular to a computer motherboard chip heat-dissipating silica gel mounting device. Background technique [0002] Thermal silica gel is a thermally conductive material with low thermal resistance, high thermal conductivity and high flexibility. The high softness of the material can reduce the pressure required between components, and at the same time cover the microscopic uneven surface so that the components are fully contacted and the heat conduction efficiency is improved, especially suitable for space-constrained heat conduction requirements. Widely used in military industry, computer, communication equipment, consumer electronics, power supply, automotive electronics, industrial electronic equipment and other fields to improve the reliability of electronic components and increase their service life, super flexible and high thermal conductivity gap filler Materials; high-power cooling system applic...

AI Technical Summary

Problems solved by technology

The existing heat-dissipating silica gel is not convenient for progressive transportation, and it is inconvenient to mount on the back of the chip of the computer motherboard, and the mounting efficiency is low.

Images