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LED Packaging Method for High Spatial Color Uniformity

A technology for LED packaging and color uniformity, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of increasing LED packaging manufacturing costs and waste of phosphor materials, so as to improve spatial color uniformity, save consumption, and reduce packaging costs Effect

Inactive Publication Date: 2020-12-08
WUHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] High-power white light LEDs are usually mixed with two-wavelength light (blue light + yellow light) or three-wavelength light (blue light + green light + red light). Currently, white light LEDs are widely used through blue LED chips (GaN) Composed of yellow phosphor (YAG or TAG), the parameters of the phosphor layer in the LED package, especially the geometric shape of the phosphor layer, seriously affect the important optical properties of the LED such as light extraction efficiency, color temperature, and spatial color uniformity. Therefore, the realization of LED The key to high spatial color uniformity of product lighting is to achieve ideal phosphor distribution, and in current LED packaging, most of the phosphor between LED chips does not participate in the conversion of blue light to yellow light, resulting in a large waste of phosphor materials , increasing the LED package manufacturing cost

Method used

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  • LED Packaging Method for High Spatial Color Uniformity
  • LED Packaging Method for High Spatial Color Uniformity
  • LED Packaging Method for High Spatial Color Uniformity

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Such as figure 1 As shown, an LED packaging method to achieve high spatial color uniformity controls the spatial distribution of phosphor powder through the action of laser and phosphor glue, including the steps: first bond the LED chip to the center of the groove on the substrate and complete the lead Bonding process to achieve electrical connection; then the phosphor and encapsulation glue are fully mixed into phosphor glue and coated around the LED chip to form a phosphor layer, which is limited in the groove area (such as Figure 1 to Figure 3 As shown, due to the effect of surface tension, the morphology of the phosphor layer is a spherical cap shape); then the phosphor layer is irradiated with laser light, and the laser points vertically to the middle of the LED chip, and the encapsulation glue that is not easy to cure is used, and the laser makes the phosphor layer The middle temperature of the layer is high, the edge temperature is low, the encapsulation glue fl...

Embodiment 2

[0034] Such as Image 6 As shown, an LED packaging method to achieve high spatial color uniformity controls the spatial distribution of phosphor powder through the action of laser and phosphor glue, including the steps: first bond the LED chip to the center of the groove on the substrate and complete the lead Bonding process to achieve electrical connection; then the phosphor and encapsulation glue are fully mixed into phosphor glue and coated around the LED chip to form a phosphor layer, which is limited in the groove area (such as Figure 1 to Figure 3 As shown, due to the effect of surface tension, the morphology of the phosphor layer is a spherical cap shape); then the phosphor layer is irradiated with laser light, the laser is vertically pointed to the middle of the LED chip, and the easy-curable encapsulant is used, and the laser makes the irradiation position The fluorescent powder glue is cured, and then left to stand naturally so that the phosphor powder in the uncure...

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Abstract

The invention discloses an LED packaging method for realizing high space color uniformity. Phosphor space distribution is controlled by the action of laser and a packaging phosphor glue; an LED chip is bonded to the center position of a groove in the substrate and electric connection is realized; the phosphor and the packaging glue are thoroughly mixed into the phosphor glue, and the phosphor glueis applied around the LED chip to form a phosphor layer; the phosphor layer is irradiated with the laser, the laser vertically points to the LED chip, the action of the laser and the phosphor glue has two modes, one mode is that when the adopted packaging glue is easy to cure, the laser enables the phosphor glue at the irradiating position to be cured, natural standing is carried out to enable the phosphor in an uncured area to be completely precipitated, a space phosphor pattern is formed, and the other mode is that when the adopted packaging glue is not easy to curve, the laser enables themiddle temperature of the phosphor layer to be high and the edge temperature to be low, a solution flows to the middle, and the phosphor is gathered at the middle LED chip under carrying of the solution; and the phosphor glue is heated and cured. The method realizes high space color uniformity.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to an LED packaging method for realizing high spatial color uniformity. Background technique [0002] LED (Light Emitting Diodes) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optical conversion efficiency, long service life, environmental protection and energy saving, and small size. It has begun to be used in landscape lighting, automotive headlights, etc. , Street lights and backlights are widely used in many fields. With the promotion of LEDs, people's requirements for LED lighting have gradually changed from "lighting" to "comfortable lighting". Therefore, spatial color uniformity has become one of the LED lighting quality evaluation indicators. [0003] High-power white light LEDs are usually mixed with two-wavelength light (blue light + yellow light) or three-wavelen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/62
CPCH01L33/48H01L33/508H01L33/62H01L2933/0033H01L2933/0041H01L2933/0066
Inventor 郑怀卢鑫耀王伟翔苏振鹏龚政
Owner WUHAN UNIV