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Full-spectrum LED light source encapsulation method for simulating sunlight and package structure thereof

A technology of LED light source and packaging method, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of difficulty in achieving the continuity of the solar spectrum and high cost, and achieve the effects of low cost, natural light emission, and comfortable light sensitivity

Inactive Publication Date: 2019-11-12
山东光因照明科技有限公司
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Problems solved by technology

[0004] The invention provides a full-spectrum LED light source packaging method and its packaging structure for simulating sunlight, so as to solve the problems in the prior art that it is difficult to achieve the continuity of the solar spectrum and the high cost

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  • Full-spectrum LED light source encapsulation method for simulating sunlight and package structure thereof
  • Full-spectrum LED light source encapsulation method for simulating sunlight and package structure thereof

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Embodiment Construction

[0014] A full-spectrum LED light source packaging method that simulates sunlight. A broad-spectrum phosphor is excited by a dual-wave chip, and a short-band blue chip with a peak wavelength of 440-442.5nm and a long-band blue chip with a peak wavelength of 457.5-460nm are fixed on the LED light-emitting unit. Band blue chip, two blue light chips are connected in series through gold wires, and the crystal is fixed on the front. The phosphors excited by the dual-wave blue light chips include green phosphors with a peak wavelength of 490nm (x=0.079±0.003, y=0.481±0.003); the peak wavelength Yellow-green powder with a peak wavelength of 525nm (x=0.347±0.003, y=0.575±0.003); a peak wavelength of 535nm (x=0.3774 ±0.003, y=0.5668±0.003) yellow-green powder and red phosphor with a peak wavelength of 660nm (x=0.6763±0.003, y=0.0.3235±0.003), these five phosphors are blended into fluorescent glue through silica gel, In the reconciled fluorescent glue, the mass of 490nm green phosphor is...

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Abstract

A full-spectrum LED light source encapsulation method for simulating sunlight and a package structure thereof are provided. A broad-spectrum phosphor is excited by a dual-waveband wafer. A short-waveband blue-light chip with a peak wavelength of 440 to 442.5 nm and a long-waveband blue-light chip with a peak wavelength of 457.5 to 460 nm are fixed to an LED unit. The two blue-light chips are connected in series by a gold wire, and are bonded in a normal way. The method uses the double-waveband wafer to excite the broad spectrum, and realizes a full-spectrum LED light source that highly simulates the solar spectrum. The color rendering index of the light source is above 98, and R1-R15 are all above 98. The full-spectrum LED light source satisfies the higher requirements of consumers for light bio-safety and healthy lighting, and has the advantages of low cost, natural light emission and comfortable photosensitivity.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a method for packaging a full-spectrum LED light source that simulates sunlight and a packaging structure thereof. Background technique [0002] With the development of LED lighting technology, people have put forward higher requirements for photobiological safety and healthy lighting. The light that the human eye is most accustomed to is sunlight, so the closer the spectrum of the artificial light source is to sunlight, the more natural and comfortable the human eye perceives the color. As the fourth-generation lighting source, white LED has the advantages of solidification, small size, low heat generation, low power consumption, long life, fast response and environmental protection. It is expected to be widely used in general lighting and backlighting in the future. field. In particular, white LED lighting is expected to be widely used in the future because it meets the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/62H01L25/075
CPCH01L25/0753H01L33/486H01L33/504H01L33/62H01L2933/0033H01L2933/0041H01L2933/0066
Inventor 李登延
Owner 山东光因照明科技有限公司
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