Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of anisotropic conductive adhesive and its preparation method and application

An anisotropic, conductive adhesive technology, applied in the field of conductive adhesives, can solve the problems of electrical conductivity and bonding performance to be improved, and achieve the effects of low raw material cost, stable electrical conductivity, and small on-resistance

Active Publication Date: 2021-03-16
深圳市南科康达科技有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The multi-layer structure anisotropic conductive adhesive film of the invention can be stored at room temperature, but its electrical conductivity and bonding performance need to be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of anisotropic conductive adhesive and its preparation method and application
  • A kind of anisotropic conductive adhesive and its preparation method and application
  • A kind of anisotropic conductive adhesive and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] A kind of preparation method of anisotropic conductive adhesive of the present embodiment comprises the following steps:

[0058] 1) Prepare the main glue; take the conductive filler with spherical polystyrene as the core and mix the epoxy resin compound at a mass ratio of 2:10, add TPU, wherein the conductive filler with spherical polystyrene as the core has a microscopic size of 5 μm The ball, the epoxy resin compound is composed of liquid epoxy resin E51 and solid epoxy resin E44, the mass ratio of liquid epoxy resin E51 to solid epoxy resin E44 is 1:1, the mass ratio of TPU to epoxy resin compound 0.3:1, stir for 30 minutes to mix evenly to obtain the main glue;

[0059] 2) preparing curing agent microcapsules;

[0060] 1') Polystyrene is dissolved in methylene chloride to obtain a solution, wherein the mass ratio of polystyrene to methylene chloride is 1:25;

[0061] 2') Add the solution obtained in step 1') to an equal volume of dispersion solution, wherein the ...

Embodiment 2

[0065] A kind of preparation method of anisotropic conductive adhesive of the present embodiment comprises the following steps:

[0066] 1) Prepare the main glue; take the conductive filler with spherical polystyrene as the core and mix the epoxy resin compound at a mass ratio of 2:10, add TPU, wherein the conductive filler with spherical polystyrene as the core has a microscopic size of 5 μm The ball, the epoxy resin compound is composed of liquid epoxy resin E51 and solid epoxy resin E44, the mass ratio of liquid epoxy resin E51 to solid epoxy resin E44 is 1:1, the mass ratio of TPU to epoxy resin compound 0.3:1, stir for 30 minutes to mix evenly to obtain the main glue;

[0067] 2) preparing curing agent microcapsules;

[0068] 1') Polystyrene is dissolved in methylene chloride to obtain a solution, wherein the mass ratio of polystyrene to methylene chloride is 1:25;

[0069] 2') Add the solution obtained in step 1') to an equal volume of dispersion solution, wherein the ...

Embodiment 3

[0072] A kind of preparation method of anisotropic conductive adhesive of the present embodiment comprises the following steps:

[0073] 1) Prepare the main glue; take the conductive filler with spherical polystyrene as the core and mix the epoxy resin compound at a mass ratio of 15:100, and add TPU, wherein the size of the conductive filler with spherical polystyrene as the core is 5 μm. The ball, the epoxy resin compound is composed of liquid epoxy resin E51 and solid epoxy resin E44, the mass ratio of liquid epoxy resin E51 to solid epoxy resin E44 is 1:1, the mass ratio of TPU to epoxy resin compound 0.3:1, stir for 30 minutes to mix evenly to obtain the main glue;

[0074] 2) preparing curing agent microcapsules;

[0075] 1') Polystyrene is dissolved in methylene chloride to obtain a solution, wherein the mass ratio of polystyrene to methylene chloride is 1:25;

[0076] 2') Add the solution obtained in step 1') to an equal volume of dispersion solution, wherein the disp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
electrical resistanceaaaaaaaaaa
electrical resistanceaaaaaaaaaa
Login to View More

Abstract

The invention discloses an anisotropic electroconductive adhesive as well as a preparation method and application thereof. The anisotropic electroconductive adhesive comprises main glue and curing agent microcapsules, wherein a mass ratio of the main glue to the curing agent microcapsules is (8-12):(0.5-2). The anisotropic electroconductive adhesive provided by the invention has good and stable electrical conductivity, good bonding property and long storage time and can be stored at room temperature for a long time; and compared with a conventional process, the preparation method of the anisotropic electroconductive adhesive provided by the invention has a reduced production process and greatly-improved storage time of the anisotropic electroconductive adhesive, the raw material costs arelow, and the adhesive can save costs for an enterprise.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesive, and in particular relates to an anisotropic conductive adhesive, a preparation method and application thereof. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It can connect a variety of conductive materials together to form an electrical path between the connected materials. In the electronics industry, conductive adhesive has become an essential new material. Conductive adhesive is used for circuit connection of electronic products, mainly used in the connection of circuit boards of FPC, IC, PCB, computer monitor, mobile phone display and liquid crystal display. Conductive adhesive is mainly composed of resin matrix, conductive particles, dispersing additives, auxiliary agents and so on. [0003] At present, the base material of the anisotropic conductive adhesive used in the market is composed of a resin base and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/00C08G59/18C09J7/25C09J7/30
CPCC08G59/188C08K2003/0806C08K2003/0831C08K2003/0862C08L2205/025C08L2205/035C08L2205/18C09J9/02C09J163/00C09J2463/00C09J2467/006C09J7/255C09J7/30C09J2301/122C08L63/00C08L75/04C08L25/06C08K3/08
Inventor 田颜清郝长祥
Owner 深圳市南科康达科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com