Resin composition for forming electrodes, chip electronic component and method for producing same
A technology of resin composition and electronic components, applied in resistor parts, electrical components, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as deterioration of bonding strength, deterioration, peeling of external electrodes, etc. The effect of small change rate of value, excellent stability and high reliability
Active Publication Date: 2019-11-15
KYOCERA CORP
View PDF6 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0010] However, in the method of Patent Document 1, heat treatment at a high temperature of 600° C. or higher is required, and therefore, the resin in the sealing material and the self-fusion film of the lead wire may deteriorate.
In the method of Patent Document 2, when the humidity resistance test is performed, the bonding strength between the main body and the external electrodes deteriorates, and the external electrodes may be peeled off.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～12、 comparative example 1～3
[0115] The components were mixed according to the formulations described in Tables 1 to 3, and kneaded with rolls to obtain a resin composition for electrode formation. The obtained resin composition was evaluated by the following method. The results are shown in Tables 1-3 together. In addition, the material used in the Example and the comparative example used the material which has the following characteristics.
[0116] [(A) ingredient]
[0117] (A1) Acrylic resin: hydroxyethylacrylamide (manufactured by Koujin Co., Ltd.; brand name: HEAA).
[0118] (A2) Imide-chain-extended bismaleimide (Designer Molecular Co., Ltd.; brand name: BMI-1500; number average molecular weight: 1,500).
[0119] (A3) Epoxidized polybutadiene resin (manufactured by Nippon Soda Co., Ltd.; brand name: JP-200).
[0120] [(A') component]
[0121] Epoxy resin: bisphenol F liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation; brand name: YL983U).
[0122] Phenolic resin: bisphenol F ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Login to View More
Abstract
Provided is a low temperature sinterable resin composition for forming electrodes, which is excellent in terms of bondability and stability of electrical resistance after moisture resistance / heat resistance treatment. A resin composition for forming electrodes ontains, as essential components, (A) a thermosetting resin, (B) a radical initiator, (C) silver fine particles having a thickness or breadth of 1-200 nm and (D) a silver powder other than the component (C), which has an average particle diameter of 2-20 [mu], and the thermosetting resin (A) contains (A1) a (meth)acrylate ester compoundor (meth)acrylamide compound having a hydroxyl group, (A2) a bismaleimide resin which is in a liquid state at room temperature, and (A3) an epoxidized polybutadiene.
Description
technical field [0001] The present disclosure relates to a resin composition for electrode formation, a chip-type electronic component in which an electrode is formed using the resin composition for electrode formation, and a method for manufacturing the same. [0002] In particular, the present disclosure relates to an electrode-forming resin composition for forming external electrodes of a surface-mount chip-type electronic component, a chip-type electronic component using the electrode-forming resin composition, and a manufacturing method thereof. Background technique [0003] Chip inductors, chip resistors, chip-type laminated ceramic capacitors, chip thermistors and other chip-type electronic components are mainly composed of a chip-shaped body composed of a ceramic sintered body, internal electrodes provided inside it, and electrodes connected to the internal electrodes. The external electrodes provided on both end faces of the chip-shaped main body are formed by solde...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22C08F2/44C08K3/08C08K5/14C08L33/14C08L33/26C08L35/00C08L63/08H01B1/00H01C1/142H01G4/30
CPCC08F2/44C08K3/08C08K5/14C08L33/14C08L33/26C08L35/00C08L63/08H01B1/00H01B1/22H01C1/142H01G4/30
Inventor 高桥翔樱井一庆
Owner KYOCERA CORP