Resin composition for electrode formation, chip-type electronic component, and manufacturing method thereof
A technology of resin composition and electronic components, applied in the manufacture of semiconductor/solid state devices, electrical components, electric solid state devices, etc., can solve the problems of deterioration of bonding strength, peeling of external electrodes, deterioration of coating film of fusion, etc., to achieve the rate of change Small, highly reliable effect
Active Publication Date: 2021-09-28
KYOCERA CORP
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Problems solved by technology
[0009] However, in the method of Patent Document 1, since heat treatment at a high temperature of 600° C. or higher is required, the resin in the sealing material and the self-fusion film of the lead wire may deteriorate.
In the method of Patent Document 2, when the humidity resistance test is performed, the bonding strength between the main body and the external electrodes deteriorates, and the external electrodes may be peeled off.
Method used
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Embodiment 1～12
[0126] (Examples 1-12, Comparative Examples 1-4)
[0127] The components were mixed according to the formulations described in Tables 1 to 3, and kneaded with rolls to obtain a resin composition for electrode formation. In Tables 1-3, the compounding quantity of each component is shown by mass parts. The obtained resin composition was evaluated by the following method. The results are shown in Tables 1-3 together. In addition, the material used in the Example and the comparative example used the material which has the following characteristics.
[0128] [(A) ingredient]
[0129] (A1) Acrylic resin: Hydroxyethylacrylamide (manufactured by Koujin Co., Ltd.; brand name: HEAA).
[0130] (A21) Imide-chain-extended bismaleimide (Designer Molecules Co., Ltd.; brand name: BMI-1500; number average molecular weight: 1500).
[0131] (A22) Imide-chain-extended bismaleimide (Designer Molecules Co., Ltd.; brand name: BMI-689; number average molecular weight: 689).
[0132] (A31) Epoxi...
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Abstract
The present invention provides a low-temperature sintering type resin composition for electrode formation that is excellent in bonding properties, resistance stability after moisture resistance and heat resistance treatment, and the like. The electrode-forming resin composition comprises (A) a thermosetting resin, (B) a radical generator, (C) silver microparticles having a thickness or a minor diameter of 1 to 200 nm, and (D) an average Silver powder with a particle size of 2 to 20 μm is an essential component, and (A) a thermosetting resin includes (A1) a (meth)acrylate compound having a hydroxyl group or a (meth)acrylamide compound having a hydroxyl group, (A2) a normal temperature At least one selected from the liquid bismaleimide resin and (A3) polybutadiene, the thixotropic index (the ratio of the viscosity at 2 rpm to the viscosity at 20 rpm at 25°C) is 1.1 ~2.0.
Description
technical field [0001] The present invention relates to a resin composition for electrode formation, a chip-type electronic component in which electrodes are formed using the resin composition for electrode formation, and a method for producing the same. In particular, the present invention relates to an electrode-forming resin composition for forming external electrodes of a surface-mount chip-type electronic component, a chip-type electronic component using the electrode-forming resin composition, and a method for producing the same. Background technique [0002] Chip inductors, chip resistors, chip-type laminated ceramic capacitors, chip thermistors and other chip-type electronic components, a chip-shaped body mainly composed of a ceramic sintered body, internal electrodes provided inside it, and the internal electrode to conduct The external electrodes provided on both end faces of the chip-like body are formed by means of a chip-shaped body, and the external electrodes ...
Claims
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IPC IPC(8): H01B1/22H01L21/28H01L23/49
CPCH01B1/22H01L21/28H01L23/49
Inventor 高桥翔
Owner KYOCERA CORP