Resin composition for electrode formation, chip-type electronic component, and manufacturing method thereof
A resin composition, electrode technology, applied in resistor parts, electrical components, conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as deterioration, deterioration of bonding strength, peeling of external electrodes, etc., to achieve stability Excellent, small change rate of resistance value, high reliability effect
Active Publication Date: 2021-01-29
KYOCERA CORP
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- Description
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- Application Information
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Problems solved by technology
[0010] However, in the method of Patent Document 1, heat treatment at a high temperature of 600° C. or higher is required, and therefore, the resin in the sealing material and the self-fusion film of the lead wire may deteriorate.
In the method of Patent Document 2, when the humidity resistance test is performed, the bonding strength between the main body and the external electrodes deteriorates, and the external electrodes may be peeled off.
Method used
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Examples
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Comparison scheme
Effect test
Embodiment 1～12、 comparative example 1～3
[0115] The components were mixed according to the formulations described in Tables 1 to 3, and kneaded with rolls to obtain a resin composition for electrode formation. The obtained resin composition was evaluated by the following method. The results are shown in Tables 1-3 together. In addition, the material used in the Example and the comparative example used the material which has the following characteristics.
[0116] [(A) ingredient]
[0117] (A1) Acrylic resin: hydroxyethylacrylamide (manufactured by Koujin Co., Ltd.; brand name: HEAA).
[0118] (A2) Imide-chain-extended bismaleimide (Designer Molecular Co., Ltd.; brand name: BMI-1500; number average molecular weight: 1,500).
[0119] (A3) Epoxidized polybutadiene resin (manufactured by Nippon Soda Co., Ltd.; brand name: JP-200).
[0120] [(A') component]
[0121] Epoxy resin: bisphenol F liquid epoxy resin (manufactured by Mitsubishi Chemical Corporation; brand name: YL983U).
[0122] Phenolic resin: bisphenol F ...
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Abstract
The present invention provides a low-temperature sintering-type electrode-forming resin composition excellent in bondability, stability of resistance after moisture resistance / heat resistance treatment, and the like. This resin composition for electrode formation comprises (A) a thermosetting resin, (B) a radical initiator, (C) silver fine particles having a thickness or a short diameter of 1 to 200 nm, and (D) an average of (D) excluding the component (C). Silver powder with a particle size of 2 to 20 μm as an essential component, (A) thermosetting resin including (A1) a (meth)acrylate compound having a hydroxyl group or a (meth)acrylamide compound having a hydroxyl group, (A2) room temperature It is a liquid bismaleimide resin and (A3) epoxidized polybutadiene.
Description
technical field [0001] The present disclosure relates to a resin composition for electrode formation, a chip-type electronic component in which an electrode is formed using the resin composition for electrode formation, and a method for manufacturing the same. [0002] In particular, the present disclosure relates to an electrode-forming resin composition for forming external electrodes of a surface-mount chip-type electronic component, a chip-type electronic component using the electrode-forming resin composition, and a manufacturing method thereof. Background technique [0003] Chip inductors, chip resistors, chip-type laminated ceramic capacitors, chip thermistors and other chip-type electronic components are mainly composed of a chip-shaped body composed of a ceramic sintered body, internal electrodes provided inside it, and electrodes connected to the internal electrodes. The external electrodes provided on both end faces of the chip-shaped main body are formed by solde...
Claims
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IPC IPC(8): H01B1/22C08F2/44C08K3/08C08K5/14C08L33/14C08L33/26C08L35/00C08L63/08H01B1/00H01C1/142H01G4/30
CPCC08F2/44C08K3/08C08K5/14C08L33/14C08L33/26C08L35/00C08L63/08H01B1/00H01B1/22H01C1/142H01G4/30
Inventor 高桥翔樱井一庆
Owner KYOCERA CORP