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Electronic assemblies incorporating laminate substrates and methods of fabricating the same

A technology of electronic components and substrates, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as failure

Pending Publication Date: 2019-11-15
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even under stress, in the presence of defects, many polymer films fail mechanically by first irreversible plastic deformation rather than immediate rupture

Method used

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  • Electronic assemblies incorporating laminate substrates and methods of fabricating the same
  • Electronic assemblies incorporating laminate substrates and methods of fabricating the same
  • Electronic assemblies incorporating laminate substrates and methods of fabricating the same

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Embodiment Construction

[0021] Embodiments disclosed herein relate to electronic assemblies incorporating flexible laminate substrates. Without limitation, the electronic assemblies described herein may be utilized in flexible displays, such as those incorporating organic thin film transistors (TFTs). Although polymer films are flexible and thus useful as substrates for electronic devices such as TFTs, polymer films lack dimensional stability. Polymer films also have other disadvantages, such as flatness, surface roughness, and barrier properties.

[0022] Embodiments of the present disclosure address these deficiencies of polymer films by utilizing thin form-factor glass-based substrates. Glass, such as that sold by Corning Incorporated under the trade name The glass sold by glass can solve the problems of plastic substrates. Flexible glass is available in thin form factors in both sheet and roll formats. Glass, glass-ceramics, and ceramics (collectively referred to herein as "glass-based subst...

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PUM

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Abstract

Electronics assemblies including laminate substrates and methods of manufacture are disclosed. In one embodiment, an electronics assembly (140A) includes a glass-based substrate (110) having a thickness of less than or equal to 300 [mu]m, a first surface (111) and a second surface, at least one gate electrode (155) disposed on the first surface (111) of the glass-based substrate (110), and a polymer layer (154) disposed on the first surface (111) of the glass-based substrate (110). The polymer layer (154) contacts at least a portion of the at least one gate electrode (155). The electronics assembly (140A) further includes at least one source electrode (152), at least one drain electrode (153), and a semiconductor material (151) disposed on the polymer layer (154). The semiconductor material (151) contacts at least a portion of the at least one source electrode (152) and the at least one drain electrode (153). The polymer layer (154) is configured to act as a dielectric material betweenthe at least one gate electrode (155) and the semiconductor material (151).

Description

technical field [0001] This application claims the benefit of priority under the Patents Act to U.S. Provisional Application Serial No. 62 / 458785 filed February 14, 2017, the contents of which are hereby incorporated by reference in their entirety This article. [0002] The present specification relates generally to electronic assemblies, and more particularly to electronic assemblies incorporating laminated substrates including layers of polymeric and glass-based materials, and methods of manufacturing the same. Background technique [0003] Active electronics on glass are typically fabricated using silicon and metal oxide technologies, as is currently practiced in thin film transistor (TFT) arrays used in liquid crystal and organic light emitting diode (OLED) displays. Current silicon and metal oxide technologies require high deposition temperatures (at least 400° C.) in order to achieve acceptable performance for commercial display applications. However, low temperature...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H01L51/05H10K99/00
CPCY02E10/549H01L27/1218H01L27/1225H10K10/471H10K77/111H01L29/51
Inventor 加里·斯蒂芬·卡拉布雷斯肖恩·马修·加纳何明谦詹姆斯·罗伯特·马修斯
Owner CORNING INC