Silicon wafer cleaning device, silicon wafer cleaning method and silicon wafer storage vehicle

Abstract

The invention provides a silicon wafer cleaning device, a silicon wafer cleaning method and a silicon wafer storage vehicle. The silicon wafer cleaning device includes a cleaning tank, a silicon waferdetection unit, a water supply pipeline, a drain pipeline and a overflow control unit, wherein the cleaning tank comprises an inner tank and an overflow tank by which the inner tank is enclosed; thesilicon wafer detection unit is used for detecting whether a silicon wafer is placed in the inner tank; the water supply pipeline is communicated with the bottom of the inner tank, and a water supplyvalve is arranged on the water supply pipeline; the drain pipeline is communicated with the bottom of the overflow tank, and a drain valve is arranged on the drain pipeline; the overflow control unitis connected with the water supply valve, the drain valve and a silicon chip detection unit to control the on-off state of the water supply valve and the drain valve. According to the silicon wafer cleaning device provided by the embodiment of the invention, whether a silicon wafer is placed in the cleaning tank or not can be detected in real time, when the silicon wafer is detected, deionized water is injected into the inner tank to an overflow state to clean the silicon wafer placed therein, so that particle impurities on the surface of the silicon wafer are washed away, and the particle impurities on the surface are prevented from being firmly attached to the surface of the silicon wafer due to oxidation and the like.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer cleaning device, a silicon wafer cleaning method and a silicon wafer storage vehicle. Background technique [0002] The silicon wafer polishing process is a process used to remove the surface damage of the silicon wafer during the forming process to obtain a mirror surface silicon wafer. [0003] During the polishing process, abrasive residues and pad dross residues are generated due to the chemical reaction of the silicon wafer with the abrasive slurry and the friction between the polishing pad and the wafer. When the slurry is recycled, unfiltered by-products are also circulated with the slurry, and the by-products accumulate on the pad surface. Therefore, when the polluted polishing pad is used for processing, the surface of the silicon wafer will be polluted by the abrasive slurry with residue particles attached to it, forming particle impuri...

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a silicon wafer cleaning device, a silicon wafer cleaning method, and a silicon wafer storage vehicle, which are used to solve the problem that abrasive slurry and other particulate impurities firmly adhere to the surface of the silicon wafer and cause contamination of the silicon wafer

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