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Inspection jig and inspection method

A fixture and pattern technology, applied in the field of inspection, can solve problems such as inaccurate pixel size, edge collapse or inaccurate processing groove width, and achieve the effect of accurate pixel size

Pending Publication Date: 2019-11-26
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, if there is a slight error in the mechanical movement amount of the wafer having the pattern used as the reference for inspection and the imaging unit, the calculated pixel size may be inaccurate, and the edge chipping measured using the pixel size may be inaccurate. Or the processing slot width may not be accurate

Method used

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  • Inspection jig and inspection method
  • Inspection jig and inspection method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0022] figure 1 It is a perspective view showing a configuration example of a processing device using the inspection jig of the first embodiment. figure 2 It is a plan view showing a structural example of the inspection jig of the first embodiment. image 3 It is a block diagram showing a configuration example of a control unit of a processing apparatus. The processing apparatus 1 is an apparatus for cutting a wafer 200 as a workpiece to divide the wafer 200 into individual chips. Such as figure 1 As shown, the processing device 1 has a chuck table (holding unit) 10, a processing unit 20, a door frame 30, a processing feed unit 40, an index feed unit 50, a cutting feed unit 60, a photographing unit 70, a display unit 74 and control unit 80.

[0023] The wafer 200 is a workpiece on which semiconductor devices or optical devices are formed, such as semiconductor wafers, optical device wafers, inorganic material substrates, ductile resin material substrates, ceramic substrat...

no. 2 Embodiment approach

[0045] Next, an inspection jig 100A of the second embodiment will be described. Figure 6 It is a plan view showing a configuration example of the inspection jig of the second embodiment. Compared with the inspection jig 100 described above, the inspection jig 100A is different in structure from the inspection jig 100 in that it has a pair of reference patterns 106 and 106 for parallel alignment. The same reference numerals are assigned to the same structures as those of the inspection jig 100 and descriptions thereof are omitted. The pair of reference patterns 106 and 106 are formed in the same shape (cross shape) with the same size. The pair of reference patterns 106 and 106 are arranged side by side in a direction parallel to the longitudinal direction of the first pattern 102 and the like. A pair of reference patterns 106, 106 are cross grooves formed on the front surface of the plate body 101 by etching, cutting or laser processing similarly to the above-mentioned first...

no. 3 Embodiment approach

[0050] Next, an inspection jig 100B according to the third embodiment will be described. Figure 7 It is a plan view showing a configuration example of the inspection jig of the third embodiment. In this third embodiment, an inspection jig 100B has a disc-shaped plate body 101B, and a pair of first reference patterns 107, 107 and a pair of second reference patterns 108, 108 are formed on the front surface of the plate body 101B.

[0051] The plate body 101B is different from the plate body 101 in that it has a disk shape, but the material and the like are the same. The first reference patterns 107 and 107 are formed in the same shape (cross shape) with the same size. The second reference patterns 108, 108 are smaller than the first reference patterns 107, 107, and are formed in the same shape (cross shape) with the same size. The first reference patterns 107, 107 and the second reference patterns 108, 108 are arranged in directions parallel to each other. The first referenc...

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Abstract

The invention provides an inspection jig and an inspection method, which can accurately measure the pixel size of a shooting unit. The inspection jig is a plate-shaped inspection jig (100) used for measuring the pixel size of a shooting unit of a processing device. A first pattern (102), a second pattern (103), and a third pattern (104) having different widths, and a two-dimensional code (105) inwhich measured values of the widths (La, Lb, Lc) of the first pattern (102), the second pattern (103), and the third pattern (104) are recorded, are provided on the front surface of a board body (101).

Description

technical field [0001] The present invention relates to an inspection jig for measuring the pixel size of an imaging unit provided in a processing device and an inspection method using the inspection jig. Background technique [0002] Generally, a processing device that cuts a workpiece such as a wafer performs an operation of notch inspection that detects edge chipping or the width of a processing groove based on an image captured on the processing device (for example, refer to Patent Document 1). . At this time, the pixel size (length per pixel; also referred to as image resolution) of the imaging unit is used for measuring the edge chipping or the width of the processed groove. [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 05-326700 [0004] In addition, in order to accurately perform the above-mentioned notch inspection, it is necessary to accurately measure the pixel size of the imaging unit. However, in the conventional configuration, a wafer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/66G01B11/02G01B11/30G01N21/84G06K7/14
CPCH01L21/67294H01L22/12G01N21/84G01B11/303G01B11/02G06K7/1417G06K7/1439G06K7/146G01N2021/8411H01L21/67242H01L21/67092H01L22/20
Inventor 花岛聪
Owner DISCO CORP
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