Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

At the same time can provide refrigeration and heat insulation box and its temperature control method

A technology for incubators and temperature control components, which is applied in refrigerators, refrigeration and liquefaction, household refrigeration devices, etc., and can solve problems such as inability to supply warm water, failure to increase market acceptance of dual-temperature semiconductor incubators, and waste of energy.

Inactive Publication Date: 2019-11-29
余建中 +1
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The semiconductor cooling chip is also called a thermoelectric cooling chip. It is a heat pump. Its advantage is that it does not require any refrigerant and can work continuously. There is no pollution source, no rotating parts, no gyration effect, and no sliding parts. There is no vibration, noise, and long life during operation. It uses the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple made of two different semiconductor materials in series, heat can be absorbed and released at both ends of the galvanic couple. Realize the purpose of cooling and heating; however, most of the previous semiconductor incubators were only used for a single function at the same time. When used as a cold preservation function, the heat energy was indirectly discharged out of the box through cooling fins and fans; as a heat preservation function In this case, the heat energy is indirectly absorbed from the outside of the box through the heat dissipation fins and the fan, and then the heat energy is conducted into the box through the semiconductor chip for heat preservation; that is to say, the existing technology only considers the heat release or heat absorption part, so at least Half of the energy is wasted and it will increase the power consumption of the fan
[0003] A small number of dual-temperature semiconductor incubators that emphasize energy saving consider both heat absorption and heat release, but they are all equipped with heat dissipation fins, fans or condensate pipes to achieve the purpose of local control of heat absorption or heat release, so that the semiconductor The refrigerating sheet can convert the absorbed heat energy into heating or hot water while keeping the cold; The cooling chip is a low-power cooling and heating component. It is used in an air conditioner that needs instant heating and cooling, and the effect is very limited. It is also used in the supply of hot water and ice water, and it cannot be used due to the space limitation in the incubator. Sufficient warm water is supplied, so that the market acceptance of existing dual-temperature semiconductor incubators cannot be improved.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • At the same time can provide refrigeration and heat insulation box and its temperature control method
  • At the same time can provide refrigeration and heat insulation box and its temperature control method
  • At the same time can provide refrigeration and heat insulation box and its temperature control method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] Such as figure 2 As shown, two sub-boxes 3, 4 with at least one surface made of high-conductivity metal are placed inside the insulated box 1, and semiconductor refrigeration is tightly adhered between the metal surface 5 and the metal surface 6 of the other sub-box. Chip 2, heat insulation gasket 12 can be put on the surroundings between the two metal surfaces, and then vacuumized or completely filled with heat insulation material to avoid mutual interference of cold and heat between the two metal surfaces; the metal of a sub-box 3 Surface 5 directly passes through the cooling surface of the chip and absorbs the heat energy in the sub-box by heat conduction, thereby playing the function of cooling and keeping cold; while the metal surface 6 of the other sub-box 4 can directly pass through the heating surface of the chip and heat energy in the sub-box by heat conduction. The heat energy is transmitted to the sub-box to play the function of heating and heat preservation...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses an insulative box capable of simultaneously providing functions of cooling, cold insulation, and heat preservation; the insulative box with a thermal-protective coatingat least comprises two sub-tanks capable of independently opening and closing a door in a heat-insulating box having a heat-insulating layer, and at least one surface of the sub-tank is made of thermal conductivity It is made of high metal, and the semiconductor wafer is tightly adhered to the semiconductor cooling wafer between the metal surface and the metal surface of another sub-tank, and directly uses the heat conduction mode to make the two sub-tanks function at the same time for cooling, cooling, and heating and heat.

Description

technical field [0001] The invention relates to an incubator with a semiconductor refrigerating sheet as the core, which further uses heat insulation technology to isolate the interference between the cooling surface and the heating surface of the semiconductor, and uses a temperature control component and an automatic opening and closing door component to control the temperature inside the box. temperature control. Background technique [0002] The semiconductor cooling chip is also called a thermoelectric cooling chip. It is a heat pump. Its advantage is that it does not require any refrigerant and can work continuously. There is no pollution source, no rotating parts, no gyration effect, and no sliding parts. There is no vibration, noise, and long life during operation. It uses the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple made of two different semiconductor materials in series, heat can be absorbed and released at bot...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): F25D31/00F25D29/00F25B21/02B65D81/18B65D85/50
CPCB65D81/18B65D85/50F25B21/02F25B2321/021F25B2321/025F25D29/00F25D31/005
Inventor 余建中
Owner 余建中
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products