Microstructure liquid self-driven flat plate type loop heat pipe with branches

Abstract

A microstructure liquid self-driven flat plate type loop heat pipe with branches comprises an evaporator. A steam channel is formed in the bottom in the evaporator, and a capillary core is arranged above the steam channel; a gas collecting tank is arranged on one side of the steam channel and is connected with the boiling pool through a connecting pipeline; the boiling pool is connected with the condenser, an outlet of the condenser is divided into two paths, one path is connected with the connecting pipeline through a branch, and the other path is connected with the compensation cavity through a liquid pipeline; the compensation cavity is located above the evaporator or the compensation cavity and the evaporator are located on the same horizontal plane. By adding the branch, when the starting time difference is too large, part of liquid flows into the compensation cavity from the outlet of the evaporator along the branch, and temperature overshoot is eliminated; when the starting timedifference is small, part of liquid directly enters the boiling pool from the outlet of the condenser along the branch, and the maximum power is improved. A columnar microstructure with a scale gradient is arranged at the bottom in the boiling pool, and a working medium is self-driven on the surface of the wetting gradient to prevent local drying.

Description

technical field [0001] The invention belongs to the field of cooling and heat dissipation of electronic components, and relates to a heat pipe heat dissipation device, in particular to a microstructure liquid self-driven plate loop heat pipe with a branch. Background technique [0002] With the rapid development of informatization, high-power electronic components are widely used in many fields. However, the problem of heat dissipation caused by the miniaturization and high power of electronic equipment has become increasingly prominent. Therefore, it is of great significance to research and develop a cooling device for electronic components with compact structure, reliable performance and high heat dissipation efficiency. Loop heat pipe, as an efficient passive phase-change heat conduction device, can realize long-distance high heat flow transmission under small temperature difference, and has become a research hotspot in the field of thermal control of high heat flow devi...

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the disadvantages of complex start-up and temperature overshoot of the current loop heat pipe cooling device with pool boiling, and at the same time solve the problem of partial drying of the boiling pool under high power, and propose a self-driven microstructure liquid with a branch Flat Loop Heat Pipe

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