Curable resin composition, dry film and cured product thereof, and printed circuit board
A technology of curable resin and composition, applied in three-dimensional rigid printed circuit boards, printed circuits, printed circuits, etc., can solve problems such as poor installation
Active Publication Date: 2022-03-25
TAIYO HLDG CO LTD
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Problems solved by technology
However, in the three-dimensional circuit board, the substrate is not necessarily perpendicular to the direction of gravity, so mounting failures such as the following may occur: liquefied solder paste flows down from the substrate during reflow processing, or solder adheres to unintended positions.
Method used
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[0103] Next, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to these Examples. In addition, in the following, unless otherwise specified, all "parts" and "%" are mass standards.
[0104]
[0105] In the following general formula (II), X is CH 2After 380 parts of bisphenol F type epoxy resin (epoxy equivalent 950g / eq, softening point 85°C) and 925 parts of epichlorohydrin are dissolved in 462.5 parts of dimethyl sulfoxide, the average degree of polymerization n is 6.2. With stirring, 60.9 parts of 98.5% NaOH was added at 70° C. over 100 minutes. After the addition, the reaction was further performed at 70° C. for 3 hours. After completion of the reaction, 250 parts of water were added and washed with water. After the oil and water are separated, most of the dimethyl sulfoxide and excess unreacted epichlorohydrin are distilled and recovered from the oil layer under reduced pressure, and the reaction product cont...
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Abstract
The curable resin composition of the present invention is a curable resin composition containing a curable resin, characterized in that a cured coating α composed of a cured product of the curable resin composition is formed on the surface of the substrate. In this case, the shear strength of the insulating portion and the cured coating α is A (MPa), and the cured coating α composed of a cured product of the curable resin composition is formed on the surface of the conductive portion of the substrate. In this case, the shear strength of the above-mentioned conductive part and the above-mentioned cured film α is set to B (MPa), and the surface of the cured film β composed of the cured product of the curable resin composition is formed on the surface of the curable resin composition. The shear strength of the above-mentioned cured film α and the above-mentioned cured film β in the case of the cured film α composed of a cured product of the composition is C (MPa). In this case, all of A, B, and C are 1 MPa or more and 15 MPa or less, and A and B are not less than 0.5 times and not more than 5 times that of C.
Description
technical field [0001] The present invention relates to a curable resin composition, and more specifically, to a curable resin composition suitable for use not only as a flat circuit board but also as an insulating cured film for a three-dimensional circuit board or the like. Background technique [0002] With the miniaturization and multifunctionalization of electronic equipment such as mobile phones and copiers, it is required to house a circuit board compactly on the inner or outer surface of a casing. For example, three-dimensional circuit substrates in circuit substrates, conductive wiring is formed on the housing or electronic components in a three-dimensional rather than planar manner, from the aspects of improving space efficiency, design, and reducing the number of components through the integration of components and circuits. Consideration is preferred. It is considered that such a three-dimensional circuit board can be manufactured by various methods. Usually, th...
Claims
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IPC IPC(8): H05K3/28C08J5/12C09D201/00G03F7/004H05K1/02B32B15/08B32B27/00
CPCC09D201/00H05K3/285H05K1/0284H05K2201/09118H05K3/3452G03F7/027C08J5/18H01B3/30H05K1/0313C08J7/0427C08J2400/24
Inventor 椎名桃子佐藤和也荒井康昭岛宫真梨子
Owner TAIYO HLDG CO LTD