A laser sintering 3D printer

A 3D printer and laser sintering technology, applied in the field of additive manufacturing, can solve the problems of complex structure and high equipment requirements, achieve the effect of simple equipment, solve cleaning problems, and reduce volume

Active Publication Date: 2022-04-22
武汉斑鹿科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing quantitative powder coating has mechanical quantitative and electric quantitative. The quantitative method of mechanical quantitative is only suitable for 3D printers of one material, and is not suitable for different materials and different amounts of powder; electric quantitative can be applied to different materials and different amounts of powder. Quantitative, but complex structure and high equipment requirements

Method used

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  • A laser sintering 3D printer
  • A laser sintering 3D printer
  • A laser sintering 3D printer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1: refer to Figure 1 to Figure 4

[0028] A laser sintering 3D printer includes a frame 1, a cylinder body, a workbench 5, a lead screw 7, a nut pair 8, a powder spreading device 3 and a powder collection box 9, and the cylinder body includes an upper cylinder body 2 and a lower cylinder body 6, The upper and lower cylinder bodies are connected through the telescopic structure 4; the telescopic structure together with the upper and lower cylinder bodies forms a sealed cavity. The workbench is arranged in the lower cylinder body and fixedly connected with the lower cylinder body. The screw 7 and the nut pair 8 are located at the center of the bottom end of the lower cylinder 6, which is consistent with the Z-axis direction of the cylinder; the lower cylinder 6 is equipped with a supporting cylinder and cooperates with the screw 7 and the nut pair 8 to make the lower cylinder 6 lift The stable guide rail 11 of motion. The telescopic structure 4 is a colloid...

Embodiment 2

[0033] The difference between this embodiment and Embodiment 1 is that the cross section of the telescopic structure is circular, and the rest of the structure, connection mode and working mode are the same as Embodiment 1.

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Abstract

The invention provides a laser sintering 3D printer, which includes a telescopic molding cylinder and a powder supply and spreading mechanism that can solve the problems of sealing and cleaning. The telescopic molding cylinder is connected to the upper and lower cylinder bodies by a telescopic structure, and the entire device is in a closed state. While solving the sealing problem, it can also improve the quality of the formed parts. In addition, because the workbench and the forming cylinder are seamlessly connected, the cleaning problem can be well solved. Including the powder supply and spreading device, the quantitative supply of powder is realized by the quantitative powder spreading mechanism, the equipment is simple and the cost is low. Including setting a powder outlet on the workbench to collect the sintered powder, avoiding adding a collection box in the molding room, and reducing the volume of the molding room.

Description

【Technical field】 [0001] The invention relates to the field of additive manufacturing, in particular to a laser sintering 3D printer. 【Background technique】 [0002] With the development of 3D printing technology, the research on laser sintering technology is getting more and more in-depth. The process of laser sintering processing parts is that the powder supply device spreads a certain amount of powder on the workbench, and then the powder is leveled by the scraper, and then the laser head sinters the current layer of powder. After the processing is completed, the supplier The powder spreading device spreads the powder, continues to scrape, and repeats this process, and the required parts will be obtained. [0003] In 3D printing technology, especially in laser sintering technology, the sealing conditions of the molding chamber are very high. Most of the current technologies focus on how to use external conditions to achieve the sealing state of the molding chamber, such ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C64/153B29C64/20B29C64/214B29C64/218B29C64/329B29C64/25B29C64/357B29C64/194B33Y30/00B33Y40/00
CPCB29C64/153B29C64/20B29C64/214B29C64/218B29C64/329B29C64/25B29C64/357B29C64/194B33Y30/00B33Y40/00
Inventor 黄纪霖康柱郑力铭吴春蕾康小青靳鹏
Owner 武汉斑鹿科技股份有限公司
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