Ground sapphire substrate slice boron carbide cleaning method
A technology of sapphire substrate and boron carbide, applied in the direction of cleaning methods using liquids, cleaning methods and utensils, chemical instruments and methods, etc.
Inactive Publication Date: 2019-12-20
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AI-Extracted Technical Summary
Problems solved by technology
The invention discloses a ground sapphire substrate slice boron carbide cleaning method. The method specifically comprises the steps of (1) conducting pure water ultrasonic cleaning to remove big-particle-size boron carbide micro powder adhering to the surfaces of wafers; (2) conducting low-frequency ultrasonic cleaning through cleaning fluid to remove big-particle-size boron carbide micro powderadhering to the surfaces of the wafers; (3) conducting physical grinding in the cleaning fluid to remove medium-particle-size boron carbide micro powder adhering to the surfaces of wafers; (4) conducting high-frequency ultrasonic cleaning through the cleaning fluid to remove small-particle-size boron carbide micro powder inlaid on the surfaces of the wafers; and (5) conducting acid corrosion to roughen the surfaces to remove tiny boron carbide micro powder on the surfaces of the wafers. According to the ground sapphire substrate slice boron carbide cleaning method provided by the invention, different cleaning processes and procedures are designed for different particle sizes of boron carbide micro powder to achieve the purpose of completely removing the boron carbide micro powder on the surfaces of the wafers. The ground sapphire substrate slice boron carbide cleaning method has the advantages of short technological process and high one-time yield. The abnormal problems that the cleaning yield is low and the quality is poor through a traditional process are solved.
Polishing machinesLapping machines +2
Acid corrosionSmall particle +4
- Experimental program(1)
Description & Claims & Application Information
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