A self-cleaning protective cover

Abstract

The invention discloses a self-cleaning protective cover, which belongs to the technical field of semiconductors, comprising: the self-cleaning protective cover is spliced ​​by a first cover part and at least one second cover part, the first cover part and each second cover The components are spliced ​​to form a through hole, and the circumferential ring of the through hole is provided with a nozzle for spraying fluid; the beneficial effect of the above technology is that by adding a nozzle for spraying fluid around the through hole, not only the bottom cover has the ability of self-cleaning, but also During the grinding process, the mist of the abrasive liquid entering the bottom cover is cleaned in real time, which reduces the deposition and crystallization of the abrasive liquid on the protective cover, and the fluid ejected through the nozzle forms an air curtain around the through hole of the bottom cover to prevent the abrasive liquid from The flying mist enters the bottom cover to play a certain isolation effect, thus effectively eliminating the problem of crystallization falling off during the grinding operation of the polishing machine, avoiding the phenomenon that the surface of the product being polished is scratched by the crystallization, and improving the quality of the polishing machine. Product yield.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a self-cleaning protective cover. Background technique [0002] Chemical mechanical polishing (CMP), also known as chemical mechanical grinding or polishing, is a commonly used technique in the manufacturing process of semiconductor devices. It uses chemical corrosion and mechanical force to planarize wafers or other substrate materials during processing. In the existing chemical mechanical polishing machine, the exposed mechanical parts in the mechanical grinding area are usually protected by a cover that matches its shape. The first purpose is to prevent the chemical mechanical polishing machine from grinding during the grinding operation. The liquid is splashed on the outer surface of the exposed mechanical parts, which will cause the grinding liquid to precipitate and crystallize on the outer surface of the mechanical parts after air drying; the second is ...

AI Technical Summary

Problems solved by technology

However, this non-enclosed design often brings hidden dangers to grinding operations

During the grinding operation of the machine, the mist of the grinding liquid brought by the high-speed rotation of the machine will enter the inside of the protective bottom cover. After the grinding liquid is dried and evaporated, crystals will be precipitated on the inner surface of the protective bottom cover. Due to the existing The protective cover does not have the self-cleaning function, and the fit of the protective cover is not tight, and there are gaps. When the tiny crystals accumulate to a certain amount, they will gather to form larger crystal particles and fall to the grinding area, resulting in the grinding of the product. The surface is scratched, which greatly reduces the yield of the product, and may even cause the product to be scrapped

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