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Glue facilitating bonding

A glue and bonding technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems of no antistatic effect, no anti-oxidation function, low environmental protection performance, etc., and achieve good antistatic function , good anti-oxidation function, enhance the effect of adhesion

Inactive Publication Date: 2019-12-20
泰州市中义电缆厂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the use of glue products has been very extensive. However, when the existing glue products are used, they have poor adhesion, low environmental protection performance, and do not have good anti-oxidation functions. Moreover, the existing glue products are not good. Has good antistatic effect, for this reason, the present invention proposes a kind of glue that is convenient for bonding

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] The invention provides a kind of glue that is convenient for bonding, comprising the following materials in parts by weight: 3 parts of epoxy resin adhesives, 20 parts of ethylene-vinyl acetate copolymer, 10 parts of water, 8 parts of glycerin, 15 parts of polyvinyl alcohol, 20 parts of butyl rubber, 20 parts of glutinous rice flour, 4 parts of emulsifier, 2-4 parts of glass fiber, 1 part of antioxidant, 5 parts of synthetic resin, 0.2 part of co-solvent, 1 part of antistatic material.

Embodiment 2

[0012] The invention provides a kind of glue that is convenient for bonding, comprising the following materials in parts by weight: 5 parts of epoxy resin adhesives, 30 parts of ethylene-vinyl acetate copolymer, 20 parts of water, 15 parts of glycerin, 20 parts of polyvinyl alcohol, 40 parts of butyl rubber, 30 parts of glutinous rice flour, 6 parts of emulsifier, 4 parts of glass fiber, 5 parts of antioxidant, 15 parts of synthetic resin, 0.4 part of co-solvent, 10 parts of antistatic material.

[0013] According to the analysis of the above examples, it can be concluded that the glue prepared in the examples can significantly improve the adhesive force by using the above formula, and the glutinous rice flour material is environmentally friendly and healthy, so that the glue material is easy to decompose without causing pollution, and the antioxidant material is used , so that the glue has a good anti-oxidation function, further improving the stability of the glue bonding, usi...

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PUM

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Abstract

The invention discloses glue facilitating bonding. The glue facilitating bonding comprises the following materials in parts by weight: 3-5 parts of an epoxy resin adhesive, 20-30 parts of an ethylene-vinyl acetate copolymer, 10-20 parts of water, 8-15 parts of glycerol, 15-20 parts of polyvinyl alcohol, 20-40 parts of butyl rubber, 20-30 parts of glutinous rice flour, 4-6 parts of an emulsifier, 2-4 parts of glass fibers, 1-5 parts of an antioxidant, 5-15 parts of synthetic resin, 0.2-0.4 part of a cosolvent and 1-10 parts of an antistatic material. By adopting the formula, the adhesive forcecan be obviously improved; the glutinous rice flour material is environmentally friendly and healthy, so that the glue material is easy to decompose without causing pollution; by adopting the antioxidant material, the glue has a good antioxidant function, and the stability of adhesion of the glue is further improved; and by adopting the antistatic material, the product has a good antistatic function when used.

Description

technical field [0001] The invention relates to the technical field of glue, in particular to a glue convenient for bonding. Background technique [0002] At present, the use of glue products has been very extensive. However, when the existing glue products are used, they have poor adhesion, low environmental protection performance, and do not have good anti-oxidation functions. Moreover, the existing glue products are not good. It has a good antistatic effect. Therefore, the present invention proposes a glue that is convenient for bonding. Contents of the invention [0003] The object of the present invention is to provide a glue that is convenient for bonding, so as to solve the problems raised in the above-mentioned background technology. [0004] In order to achieve the above object, the present invention provides the following technical scheme: a kind of glue that is convenient for bonding, including the following materials in parts by weight: 3-5 parts of epoxy resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J123/22C09J103/02C09J163/00C09J129/04C09J201/00C09J11/06C09J11/04
CPCC08L2201/04C08L2201/08C08L2205/035C09J11/04C09J11/06C09J103/02C09J123/0853C09J123/22C08L23/22C08L3/02C08L63/00C08L29/04C08L101/00C08K7/14C08K5/053C08L23/0853
Inventor 不公告发明人
Owner 泰州市中义电缆厂