Overlay error compensation method and system for three-dimensional device
A technology of overlay error and compensation method, which is applied in semiconductor/solid-state device testing/measurement, instruments, electrical components, etc., can solve overlay error and other problems, achieve overlay error, correction and performance improvement, and eliminate random error Effect
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[0047] The specific implementation manner of the present invention will be described below in conjunction with the accompanying drawings.
[0048] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, therefore, the present invention is not limited to the specific embodiments disclosed below limit.
[0049]In order to solve the overlay error caused by the height difference caused by wafer deformation and warpage, the present invention provides an overlay error compensation method and system for a three-dimensional device. On the basis of the existing overlay measuring method, the invention adds the correction and compensation of wafer warpage height and layer thickness to overlay error. That is, on the basis of measuring the first set of engraving errors between wafer overlay marks, then measure the warpage height...
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