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Wafer wet processing system and method

A wet processing and wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of dirty particles and impurities, lower wafer yield, quality and reliability, wafer cleaning or etching degree Different problems, to achieve the effect of improving the yield rate

Pending Publication Date: 2019-12-27
SHENZHEN SITAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous use of the cleaning solution, the concentration of the cleaning solution will change, and the particles and impurities will become dirty, which will eventually lead to different cleaning or etching degrees of wafers in different batches, which will affect the yield, quality and reliability of wafers. sex

Method used

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  • Wafer wet processing system and method
  • Wafer wet processing system and method
  • Wafer wet processing system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] figure 2 A wafer wet processing system provided in Embodiment 1 of the present invention is used for cleaning and / or etching wafers, and specifically includes: a shower head 22 and a vacuum chuck 24 .

[0046] The shower head 22 is provided with at least one spray hole, and the shower head 22 is connected to at least one liquid barrel 21 through a liquid inlet pipe 231 . specific. The shower head 22 is connected with the liquid inlet pipe 231 to supply cleaning liquid through the liquid inlet pipe 231, and the liquid to be sprayed includes one or more of cleaning liquid, etching liquid or DI pure water; Distributed on the shower head 22 , it can be distributed in a circle and expand layer by layer from the inside to the outside, and the shower head is a Teflon shower head 22 . In other embodiments, the wafer wet processing system further includes a spray switch 23 disposed on the liquid inlet pipe 231 for controlling the flow rate of the liquid to be sprayed.

[004...

Embodiment 2

[0052] image 3 and Figure 4 A wafer wet processing system provided in Embodiment 2 of the present invention is used for cleaning and / or etching wafers, and specifically includes: at least one liquid bucket 21, a shower head 22, a shower switch 23, a vacuum chuck 24, Vacuum pressure sensor 25, vacuum pump 26, vacuum valve 27 and upper computer 28.

[0053] At least one liquid bucket 21 is used to hold the liquid to be sprayed, and the liquid to be sprayed includes one or more of cleaning liquid, etching liquid or DI pure water.

[0054] The shower head 22 is provided with at least one spray hole, and the shower head 22 is connected to at least one liquid barrel 21 through a liquid inlet pipe 231 . Specifically, a large number of spray holes are evenly arranged on the spray head 22 , and can be distributed in a circle and expand layer by layer from the inside to the outside, and the spray head is a Teflon spray head 22 .

[0055] The spray switch 23 is arranged on the liqui...

Embodiment 3

[0072] Figure 11 A wafer wet processing method provided in Embodiment 3 of the present invention is used for cleaning and / or etching a wafer. The wafer wet processing method in this embodiment can be controlled and executed by a host computer, including:

[0073] Step 202 , judging whether the wafer is placed on the suction plate, the suction plate includes at least one through hole.

[0074] In this embodiment, the bearing suction plate is located on the vacuum chuck, the vacuum chuck also includes a housing, the housing and the bearing suction plate form the cavity of the vacuum chuck, and at least one through hole is arranged on the bearing suction plate and penetrates the cavity of the vacuum chuck Body, specifically, the bearing suction plate of the vacuum suction cup is installed upwards perpendicular to the direction of gravity. In this embodiment, judging whether the wafer is placed on the suction plate includes: judging whether the wafer is placed on the suction pla...

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Abstract

The invention discloses a wafer wet processing system and method, and the system comprises a spraying head which is provided with at least one spraying hole and is used for spraying to-be-sprayed liquid; a vacuum chuck which is located below the spraying head, wherein the vacuum chuck comprises a bearing suction plate and a shell, the shell and the bearing suction plate form a cavity of the vacuumchuck, the bearing suction plate is further provided with at least one through hole penetrating through the cavity, and the bearing suction plate is used for containing the wafer. The problem of uneven wafer cleaning and / or etching is solved, and the effect of improving the yield, quality and reliability of wafers is achieved.

Description

technical field [0001] Embodiments of the present invention relate to wafer wet processing technology, and in particular to a wafer wet processing system and method. Background technique [0002] In the prior art, when cleaning or etching the wafer manufacturing process, the "water tank immersion" method in the traditional silicon process is generally used, see figure 1 In this method, a plurality of wafers 1 are vertically placed in a wafer basket 12, and then the wafers 11 and the wafer basket 12 are simultaneously immersed in a chemical tank 13 containing a cleaning solution or an etching solution 14, and after a period of time, the Wafer 11 and wafer basket 12 are taken out. Using the method to clean and / or etch the lower end of the wafer is first contacted with the cleaning solution or etching solution, and finally separated from the cleaning solution or etching solution; the upper end of the wafer is last contacted with the cleaning solution or etching solution, and i...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67057H01L21/67086H01L21/6838
Inventor 刘召军林大野吴国才
Owner SHENZHEN SITAN TECH CO LTD