Heterogeneous high-entropy alloy material and preparation method thereof

A high-entropy alloy and heterogeneous technology, which is applied in the field of heterogeneous high-entropy alloy materials and their preparation, can solve the problems of cumbersome process of composite plates, low production efficiency, etc., and achieves low cost, high recovery rate and simple preparation process. Effect

Active Publication Date: 2019-12-31
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the limitation of this method is that the preparation process of the composite plate is relatively cumbersome, and the plate used for rolling needs to be cut, polished, fixed, and heated many times, and the production efficiency is low.

Method used

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  • Heterogeneous high-entropy alloy material and preparation method thereof
  • Heterogeneous high-entropy alloy material and preparation method thereof
  • Heterogeneous high-entropy alloy material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Such as Figure 1-4 As shown, the following embodiments include four steps, respectively: chip making, chip mixing and pre-compaction, plastic deformation treatment, annealing treatment, wherein:

[0030] Such as figure 1 As shown, in a vacuum glove box 1 filled with argon protection, using a micro vertical milling machine 2 to pair CoCrFeNiMn (face-centered cubic single-phase structure) and Al 0.3 CoCrFeNi (face-centered cubic + body-centered cubic dual-phase structure) two high-entropy alloys were used for chip preparation, and the milling feed rate was 0.2 mm to obtain coarse chips with a thickness of about 0.2 mm. Then use the micro-crusher 3 to finely crush the milled coarse chips, reduce and uniform the length of the chips to 0.2-0.3mm for later use.

[0031] Such as figure 2 As shown, in a vacuum glove box 1 filled with argon protection, the CoCrFeNiMn and Al 0.3 The CoCrFeNi high-entropy alloy chips are mechanically alloyed and mixed by vibrating, stirring,...

Embodiment 2

[0035] Such as Figure 1-4 As shown, the following embodiments include four steps, respectively: chip making, chip mixing and pre-compaction, plastic deformation treatment, annealing treatment, wherein:

[0036] Such as figure 1 As shown, in a vacuum glove box 1 filled with argon protection, using a micro vertical milling machine 2 to pair CoCrFeNiMn (face-centered cubic single-phase structure) and Al 0.3 CoCrFeNi (face-centered cubic + body-centered cubic dual-phase structure) two high-entropy alloys were used for chip preparation, and the milling feed rate was 0.1 mm to obtain coarse chips with a thickness of about 0.1 mm. Then use the micro-crusher 3 to finely crush the milled coarse chips, reduce and uniform the length of the chips to 0.1-0.2mm for later use.

[0037] Such as figure 2 As shown, in a vacuum glove box 1 filled with argon protection, the CoCrFeNiMn and Al 0.3 The CoCrFeNi high-entropy alloy chips are mechanically alloyed and mixed by vibrating, stirring, s...

Embodiment 3

[0041] Such as Figure 1-4 As shown, the following embodiments include four steps, respectively: chip making, chip mixing and pre-compaction, plastic deformation treatment, annealing treatment, wherein:

[0042] Such as figure 1 As shown, in a vacuum glove box 1 filled with argon protection, using a micro vertical milling machine 2 to pair CoCrFeNiMn (face-centered cubic single-phase structure) and Al 0.3 CoCrFeNi (face-centered cubic + body-centered cubic dual-phase structure) two high-entropy alloys were used for chip preparation, and the milling feed rate was 0.1 mm to obtain coarse chips with a thickness of about 0.1 mm. Then use the micro-crusher 3 to finely crush the milled coarse chips, reduce and uniform the length of the chips to 0.1-0.2mm for later use.

[0043] Such as figure 2 As shown, in a vacuum glove box 1 filled with argon protection, the CoCrFeNiMn and Al 0.3 The CoCrFeNi high-entropy alloy chips are mechanically alloyed and mixed by vibrating, stirring,...

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Abstract

The invention discloses a heterogeneous high-entropy alloy material and a preparation method thereof. The method comprises four processes of chip manufacturing, chip mixing and pre-compaction, plasticdeformation treatment and annealing treatment, wherein two or more high-entropy alloys of a single phase structure and a double phase structure with different grain refining effects are selected, chips of the alloys are fully mixed, then are subjected to plastic deformation, the chips are completely mechanically alloyed through high-temperature and high-strain, a dense and multi-component-mixed heterogeneous high-entropy alloy block blank is obtained, and a heterogeneous structure with mixed multi-scale grains is formed through subsequent annealing heat treatment. According to the heterogeneous structure with the combination of a soft phase and a hard phase, significant back stress strengthening can be formed in the deformation process, so that the heterogeneous high-entropy alloy with high strength and toughness is prepared.

Description

technical field [0001] The invention relates to a heterogeneous high-entropy alloy material and a preparation method thereof, belonging to the field of metal material preparation. Background technique [0002] A high-entropy alloy is a new type of metal material that is mixed with five or more elements in an equiatomic or approximately equiatomic ratio, where the atomic content of each element is between 5% and 35%. By rationally optimizing the types and proportions of elements, high-entropy alloys can form solid solution structures such as body-centered cubic, face-centered cubic, and two-phase mixtures, thereby exhibiting some excellent properties, such as good corrosion resistance and radiation resistance. , thermal stability, and high strength, hardness and wear resistance. However, like traditional metal materials, the contradiction between strength and toughness of high-entropy alloys still exists, and its characteristics are hard and brittle, or soft and tough. How ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/04C22F1/02
CPCC22C1/04C22F1/02
Inventor 周浩魏康赵永好高波陈雪飞曹阳李玉胜
Owner NANJING UNIV OF SCI & TECH
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