A lead frame bonding device

Abstract

The invention discloses a chip adhering device for a lead frame, which comprises a lower box body, and is characterized in that a pair of horizontal movement mechanisms is arranged on the lower box body in the horizontal direction, a transverse movement mechanism is arranged on the horizontal movement mechanisms, a lifting movement mechanism is arranged on the transverse movement mechanism, the upper surface of the lower box body is provided with a solder paste groove, the upper surface of the lower box body is provided with a placement mechanism, and a chip placement plate is inserted into the placement mechanism. According to the invention, the chip adhering operation of the lead frame can be automatically completed, the chip adhering efficiency of the lead frame is improved, the movement stability in each dimension is high, the production efficiency of a semiconductor is improved, the chip placement plate can be stably fixed to the device, the chip adhering accuracy of the lead frame is improved, and the chip adhering device has high practicability.

Description

technical field [0001] The invention relates to the related technical field of semiconductor manufacturing equipment, in particular to a lead frame core bonding device. Background technique [0002] As the chip carrier of the integrated circuit, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit and the outer lead by means of bonding materials such as gold wire, aluminum wire, and copper wire, and forms an electrical circuit. The bridge function of the external wire connection, most of the semiconductor integrated blocks need to use the lead frame, which is an important basic material in the electronic information industry. [0003] After the lead frame is produced, the chip is bonded to the lead frame with solder paste. During the production process, the chip is small, so it is inconvenient to bond it to the lead frame in a conventional way, and multiple chips often need to be bonded to the...

AI Technical Summary

Problems solved by technology

[0003] After the lead frame is produced, the chip is bonded to the lead frame with solder paste. During the production process, the chip is small, so it is inconvenient to bond it to the lead frame in a conventional way, and multiple chips often need to be bonded to the lead frame , so how to improve the efficiency of lead frame die attach

[0004] The conventional lead frame chip bonding device has low efficiency, which seriously affects the production efficiency of semiconductors. At the same time, the positioning of the lead frame is not easy to achieve

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