Portable temperature-controllable micro insulation box

Abstract

The invention discloses a portable temperature-controllable micro insulation box. The portable temperature-controllable micro insulation box comprises an outer box, an inner box and a box cover; the outer box is hinged with the box cover; the inner wall of the outer box is fixedly connected with a thermal insulation layer; the thermal insulation layer and the inner box are fixedly connected through a sealing frame; a cavity is formed between the inner box and the thermal insulation layer; an insulation plate is arranged in the cavity; an electric heating wire is arranged in the cavity; a temperature detector is mounted in the inner box; pull frames are in damping hinging to the two sides of the outer box through pin shafts; universal wheels are arranged at the bottom of the outer box; anda display screen, an accumulator and a switch are arranged on the right outer wall of the outer box. The thermal insulation layer is used for insulation; through multiple sets of thermal insulation, the insulation effect is excellent; meanwhile, the temperature in the insulation box can be known through the temperature detector and a display screen under the condition of not opening the insulationbox; when the temperature in the insulation box is lower, the insulation plate can be heated through the electric heating wire to increase the temperature in the insulation box; and the insulation box can move through the pull frames and the universal wheels, so that the manual carrying is not needed, and the operation is more convenient.

Description

technical field [0001] The invention relates to the technical field of incubators, in particular to a portable miniature temperature-controllable incubator for semiconductor device processing. Background technique [0002] With the continuous development of science and technology, people's lives are increasingly connected with high-tech products such as mobile phones and computers. The development of these high-tech industries is inseparable from the application of semiconductor integrated circuits. The key to the production of integrated circuits lies in the development and production of chips. Semiconductor chips need to be heated and cooled during the production process, and temperature changes bring significant changes to the structure and performance of semiconductor chips. If the temperature changes drastically, it will cause the failure of the semiconductor device. [0003] Existing thermal insulation equipment for semiconductor devices is large in size and consume...

AI Technical Summary

Problems solved by technology

If the temperature changes sharply, it will cause the failure of semiconductor devices

[0003] Existing thermal insulation equipment for semiconductor devices is large in size and consumes a lot of energy. For some tiny semiconductor devices, if the above-mentioned large-scale equipment is used, not only the energy consumption is large, but also the temperature control accuracy is not enough, which is easy to cause chip damage and the yield rate is not high

Moreover, the existing incubator can only play the role of heat preservation. With the increase of time, the temperature in the incubator drops significantly, which cannot meet the smoothness requirements of semiconductor device temperature rise and fall.

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