A 3D Integrated Filter Based on Through-Glass Vias

A through-glass hole and three-dimensional integration technology, which is applied in the direction of waveguide devices, circuits, electrical components, etc., can solve the problems of reducing system weight, large filter volume, large chip area, etc., to achieve coupling noise elimination, small size, and convenient integrated effect

Active Publication Date: 2020-10-09
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, the existing integrated filters are mainly composed of planar capacitors and inductors made of top-layer metal, which occupy too much chip area, resulting in too large filter volume, and it is difficult to reduce the weight of the system

Method used

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  • A 3D Integrated Filter Based on Through-Glass Vias
  • A 3D Integrated Filter Based on Through-Glass Vias
  • A 3D Integrated Filter Based on Through-Glass Vias

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Embodiment 1

[0042] See figure 1 , Figure 2a-2d , image 3 , Figure 4 , Figure 5 , figure 1 It is a structural front view of a three-dimensional integrated filter based on through-glass vias provided by an embodiment of the present invention, Figure 2a-2d It is a structural front view of the first layer, the second layer, the third layer, and the fourth layer of a three-dimensional integrated filter based on through-glass vias provided by an embodiment of the present invention, image 3 It is a structural front view of a three-dimensional integrated filter based on through-glass vias provided by an embodiment of the present invention, Figure 4 is a side view of a three-dimensional integrated filter based on through-glass vias provided by an embodiment of the present invention, Figure 5 is an equivalent circuit diagram of a three-dimensional integrated filter based on through-glass vias provided by an embodiment of the present invention. An embodiment of the present invention p...

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PUM

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Abstract

The invention discloses a three-dimensional integrated filter based on glass through holes. The filter comprises a first layer, a second layer, a third layer and a fourth layer, wherein the first layer comprises first metal plates and first metal wires, and the plurality of first metal plates are connected with the first metal wires; the second layer comprises a dielectric substrate and a second metal plate, the dielectric substrate is arranged above the first metal plates and the first metal wires, and the second metal plate is arranged in the dielectric substrate; the third layer comprises aglass substrate and glass through holes, the glass substrate is arranged above the second layer, and the glass through holes penetrate through the glass substrate; the fourth layer comprises a thirdmetal plate and a second metal wire, the second metal wire is arranged above the third layer and defines a second area structure, and the third metal plate is arranged in the second area structure. According to the invention, a three-dimensional spiral inductor and a plate capacitor are constructed based on the glass through holes, and an equivalent filter structure formed by series-parallel connection of the three-dimensional spiral inductor and the plate capacitor is compact in structure, small in size, convenient to integrate and flexible in design.

Description

technical field [0001] The invention belongs to the technical field of radio frequency / microwave integrated circuits, and in particular relates to a three-dimensional integrated filter based on through-glass holes. Background technique [0002] In radio frequency integrated circuits, filters, as an indispensable frequency selection component in communication systems, play a very important role and are widely used in various radio frequency integrated circuits. [0003] Filters are critical to improving the overall operating quality of a communication system. With the increasing demand for high-speed wireless mobile communication and high-performance chips, the development of filters with smaller size and lighter weight is very urgent. At present, the existing integrated filters are mainly composed of planar capacitors and inductors composed of top-layer metals, which can meet broadband performance and channel isolation. However, with the rapid development of three-dimension...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20
CPCH01P1/20
Inventor 刘阳刘晓贤卢启军尹湘坤朱樟明杨银堂
Owner XIDIAN UNIV
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