100 results about "Channel isolation" patented technology

Embodiments of the present disclosure provide a semiconductor device structure having vertically stacked complementary field effect transistors (CFETs). The CFETs are formed by bonding two substrates having semiconductor stacks formed thereon. A bonding structure is formed between the semiconductor stacks using wafer bonding technology. Embodiments of the resent disclosure enable the flexibility of choosing different N / P channel properties, provide a simple way to form the N / P channel isolation structure, and reduce potential leakage path and defects in stacked CFETs.

The invention discloses a negative pressure suction device for ear canal flushing. The negative pressure suction device comprises a handheld shell, a fluid channel assembly, a sealing adapter, a cleaning fluid supply unit and a negative pressure generation unit. A cavity is formed in the handheld shell; the fluid channel assembly penetrates through the cavity, the two ends of the fluid channel assembly extend out of the head and the tail of the handheld shell respectively, and the fluid channel assembly is provided with a cleaning fluid nozzle and a negative pressure suction port close to the head and communicated with a flushing channel and a negative pressure channel which are isolated from each other in the fluid channel assembly respectively. The sealing adapter is arranged at the tail of the handheld shell and used for being connected with the fluid channel assembly and guiding a flushing channel and a negative pressure channel of the fluid channel assembly to corresponding external interfaces after the flushing channel and the negative pressure channel are isolated. The cleaning fluid supply unit is communicated with the flushing channel to provide cleaning fluid; the negative pressure generating unit is communicated with the negative pressure channel to provide negative pressure power. According to the auditory meatus flushing device, through the physically-isolated double-channel design and a flushing and suction mechanism working synchronously, flushing fluid residues and cross contamination are effectively avoided, and the safety, efficiency and reliability of auditory meatus flushing operation are improved.

The invention discloses a three-dimensional stacked multi-channel radio frequency module based on a mixed ceramic material, and relates to the technical field of microelectronic packaging. The invention relates to a radio frequency module which comprises an HTCC tube shell and a DPC tube shell which are arranged in an overlapped mode, the interior of the HTCC tube shell is divided into at least two independent cavities used for installing radio frequency chips through a metal enclosure frame, a control and power supply chip is installed in the DPC tube shell, and a solder ball array is further arranged on the lower surface of the DPC tube shell; the three-dimensional stacked packaging structure further comprises a radio frequency vertical interconnection piece, the radio frequency vertical interconnection piece is vertically arranged in the DPC tube shell and extends upwards, and the HTCC tube shell and the DPC tube shell are fixedly connected through the radio frequency vertical interconnection piece to form the three-dimensional stacked packaging structure. The invention provides a three-dimensional stacked multi-channel radio frequency module based on a mixed ceramic material, which can significantly reduce the overall packaging cost and complexity through heterogeneous material integration and three-dimensional stacking on the premise of ensuring high-efficiency heat dissipation and high channel isolation of a high-power radio frequency chip. And the multi-channel radio frequency SiP packaging with high performance, miniaturization and low cost is realized.

The invention discloses an isolated SPI (Serial Peripheral Interface) data transmission system and method. The system comprises an SPI primary side, an isolated transmission interface with two channels and an SPI secondary side. The SPI primary side maps MOSI, SCLK and CSB signals from a host into a unified sending data packet through protocol conversion; the system transmits the sending data packet and the response data packet from the secondary side through the first isolation channel and the second isolation channel, so that a complete SPI communication protocol is realized. Through an innovative protocol conversion architecture, traditional four-wire SPI communication is adapted to a dual-channel isolation interface, the number of required isolation channels is remarkably reduced while high reliability is ensured, and the problem of multi-channel delay inconsistency is solved, so that the technical effects of saving the chip area and reducing the overall power consumption are achieved.

The application discloses a kind of multilayer double-channel substrate integrated waveguide filters, belong to microwave communication technical field, including sequentially stacked multiple SIW cavities, the second metal substrate of top layer SIW cavity is equipped with first direction slot gap;The first metal substrate of bottom layer SIW cavity is equipped with second direction slot gap;In intermediate SIW cavity: the first metal substrate of second layer SIW cavity is equipped with first direction slot gap, the second metal substrate of penultimate layer SIW cavity is equipped with second direction slot gap, and the rest metal substrate is all equipped with the cross slot gap combined into by first direction slot gap and second direction slot gap;First direction slot gap and second direction slot gap are aligned with cross slot gap;Filter first channel includes first input port, all first direction slot gap and first output port;Filter second channel includes second input port, all second direction slot gap and second output port.The application shows good frequency selection characteristic and high channel isolation.

The present disclosure relates to IC structures including a porous semiconductor layer located beneath a channel isolation proximate to a source / drain region. An integrated circuit (IC) structure includes an active device located above a bulk semiconductor substrate, and an isolation structure in the bulk semiconductor substrate surrounding the active device. The active device includes a semiconductor layer having a central region, a first end region laterally spaced apart from the central region by a first trench isolation, a second end region laterally spaced apart from the central region by a second trench, a gate located above the central region, and a source / drain region located in each of the first and second end regions. The isolation structure includes a polysilicon isolation layer located beneath the active device, a third trench isolation surrounding the active device, and a porous semiconductor layer located between the first trench isolation and the polysilicon isolation layer and between the second trench isolation and the polysilicon isolation layer.

The utility model discloses a multichannel isolation type current and voltage signal processing board card comprising a board card main body, and the board card main body is provided with a plurality of signal input channels, a signal isolation module, a signal processing module, a microprocessor and a signal output interface. Each signal input channel comprises a current input port and a voltage input port, an isolation unit of the signal isolation module comprises a current isolation circuit and a voltage isolation circuit, and isolation input of multichannel signals is achieved. The signal processing module carries out amplification, analog-to-digital conversion and filtering processing on the isolated signals, the microprocessor carries out operation processing on the signals, and the signal output interface outputs the processed signals. According to the utility model, inter-channel signal interference and external electromagnetic interference are effectively prevented, the signal acquisition precision and the anti-interference capability of the board card are improved, and the connection requirements of various devices are met.

The invention discloses an application program resource monitoring method and device, electronic equipment and a storage medium, and relates to the technical field of computers, and the application program resource monitoring method comprises the steps that an out-of-band monitoring module is adopted to collect application program resource data, isolation of a monitoring channel and a service channel is achieved, and the service channel is monitored. Meanwhile, a resource use model of a time dimension is constructed based on real data to simulate production environment resource behaviors, and then performance pressure measurement and fault reproduction analysis are supported, so that the problems that in an existing monitoring and control method, due to the fact that an internal agent of a virtual machine is adopted and the virtual machine is not isolated from a service channel, monitoring data distortion is caused, application program operation is disturbed, and the service performance is affected can be solved. According to the technical scheme of the invention, the technical problems in the prior art are solved, and the technical effects of guaranteeing the accuracy of monitoring data, avoiding the interference on the operation of the application program, improving the performance optimization effect and effectively supporting the performance pressure measurement and fault reproduction analysis of the cloud computing system are achieved.

This application discloses a health management and resource optimization configuration method for a distributed power supply in a test cabinet. The method includes: collecting electrical and temperature parameters of multiple sub-modules of the power supply during operation; extracting feature vectors representing the degradation state of the power supply based on a sliding time window; obtaining health information of multiple sub-modules; adaptively adjusting the reporting strategy of health information; and outputting power control commands for at least one sub-module. When a sub-module's health risk indicator is detected to exceed a preset risk threshold, the sub-module is marked as a risk sub-module, and at least one type of migrateable load is migrated from the risk sub-module to a candidate sub-module. Output channel isolation control is performed on the risk sub-module, and the power supply path used for status detection is retained. The display priority of multiple sub-modules is calculated, sorted and displayed according to the display priority, and multi-level alarm prompts corresponding to the health risk indicators are triggered simultaneously.

A method is provided for fabricating a semiconductor device. A sacrificial layer is formed over a semiconductor substrate. A fin feature and source / drain spaces are formed over the sacrificial layer. A part of the sacrificial layer is exposed in each of the source / drain spaces. Sacrificial features are formed in the source / drain spaces. Source / drain features are formed over the sacrificial features in the source / drain spaces. The sacrificial layer and the sacrificial features are removed to form air-isolation features under the source / drain features, and an air-gap layer is formed in spatial communication with and under the air-isolation features. A gate feature is formed in the fin feature.

Provided are a semiconductor device and a preparation method therefor, the method including the following steps: providing a substrate and forming a drift region in the substrate; forming a plurality of channel isolation regions in the drift region, a space being defined between two adjacent ones of the channel isolation regions to form a channel region; and forming a source contact region, a drain contact region, and a gate contact region in the drift region, and forming a substrate contact region in the substrate, the substrate contact region being spaced apart from the drift region, the gate contact region being positioned between the source contact region and the drain contact region, and the channel region being in communication with the source contact region and the drain contact region. In the solutions of the present disclosure, a plurality of channel isolation regions are formed, with a space defined between two adjacent ones of the channel isolation regions to form a channel region. By adjusting the width of the channel region to regulate the pinch-off voltage of the device, a sufficiently high on-current of the device during conduction can be ensured, thereby reducing the on-resistance of the device, lowering the power consumption of the device, and enhancing the device performance.

The invention discloses a single-pole double-throw switch filtering assembly based on an LTCC (Low Temperature Co-Fired Ceramic) technology. A switching circuit and an LTCC resonator are integrated, and the on-off state of a switching diode in the working process is controlled by an externally applied direct current bias voltage. When the diode is in a conducting state, the parasitic inductor and the capacitor form series resonance, and the equivalent coupling admittance converter passing through the resonator can be inverted and equivalent to an open circuit, so that a branch signal is cut off, and channel isolation is realized; and when the diode is in a closed state, the electromagnetic field distribution of the substrate integrated waveguide resonator is not obviously influenced, the filter keeps normal work, and signal passband transmission is realized. According to the structure, on one hand, the SIW waveguide integration form is used for achieving the low insertion loss characteristic; and on the other hand, the stop-band suppression degree is effectively improved by introducing the cross coupling topology. The whole circuit has the advantages of being compact in structure, low in loss, high in isolation degree, excellent in out-of-band rejection performance and the like, and the requirements of 5G and future high-speed wireless communication systems can be met.

This invention discloses a linear multi-zero cavity duplexer based on a hybrid resonator. The duplexer comprises a rectangular hollow metal cavity, a common signal terminal at the top of the cavity, and two signal branches on either side. The branches employ a hybrid cascaded structure of single-mode and dual-mode metal resonators, forming a linear topology without cross-coupling. The dual-mode metal resonator can operate simultaneously in inter-plate coupling mode and coaxial mode. The resonant mode order is set by pre-setting the internal inter-plate distance, allowing each branch to generate two preset transmission zeros. This invention achieves a six-pole filtering response using only four resonant cavities, forming a dual passband and generating four preset transmission zeros, ensuring high quality factor and high channel isolation while achieving device miniaturization. This invention features a simple structure, easy fabrication, and independently and precisely adjustable coupling parameters, making it suitable for 5G / 6G communication, emergency communication, and UAV-borne high-performance miniaturized RF front-end applications.

The invention provides a mining wireless sensor system and a communication method thereof, the mining wireless sensor system comprises a wireless receiving end, a wireless sensor, a hand-held terminal and a main controller, the wireless receiving end and the wireless sensor are both in bidirectional communication with the hand-held terminal through Bluetooth, and the wireless receiving end is also in bidirectional communication with the main controller through Ethernet. And the wireless receiving end is also in wireless communication with the wireless sensor through LoRa. The mining wireless sensor system has the advantages that the communication and power supply modes of a traditional sensor are changed, wireless communication and battery power supply modes are used, arrangement of power lines and data lines is reduced, the work of laying and disassembling cables by workers is greatly reduced, the equipment failure rate is effectively reduced, and the installation position is flexible. Low-power-consumption components are selected, and the standby time of the sensor is prolonged by optimizing power consumption management through cooperation of software and hardware. The system can set different communication channels or communication rates through a mobile phone APP, and prevents co-frequency interference through channel isolation.

The application relates to the field of magnetic storage, in particular to a magnetic storage device, which comprises a fixed layer, a channel isolation layer and a free layer; the channel isolation layer is located between the fixed layer and the free layer; further comprising a non-magnetic layer, which is located on the free layer, and the material of the non-magnetic layer is different from that of the free layer. The application can effectively reduce the critical current for changing the magnetization direction of the free layer of the MTJ and reduce the volume of the magnetic storage device.

Channel isolation structures and methods of forming the same are provided. A device includes: a multilayer stack including: a first plurality of nanostructures; a second plurality of nanostructures over the first plurality of nanostructures; and a first channel isolation structure. The device further includes a first source / drain region on opposite ends of the first plurality of nanostructures; a second source / drain region over the first source / drain region, the second source / drain region on opposite ends of the second plurality of nanostructures; a first gate structure surrounding the first plurality of nanostructures; and a second gate structure surrounding the second plurality of nanostructures. The first gate structure contacts a first lateral surface of the first channel isolation structure. The embodiment of the invention discloses a transistor device and a forming method thereof.

The embodiment of the invention provides a gate-all-around transistor and a forming method thereof. The method comprises the following steps: providing a substrate comprising a substrate, discrete fin parts protruding from the substrate, an isolation sacrificial structure located on the fin parts, and a channel lamination layer located on the isolation sacrificial structure; a trench isolation layer and a dummy fin part are formed between the fin parts, the trench isolation layer covers and isolates the side wall of the sacrificial structure and a part of the side wall of the dummy fin part, and the side wall of the channel lamination layer is exposed; forming a pseudo gate structure crossing the channel stack; removing partial thickness of the trench isolation layer exposed by the pseudo gate structure, exposing the isolation sacrificial structure, and taking the residual trench isolation layer as a shallow trench isolation structure; the isolation sacrificial structure exposed on the side wall of the pseudo gate structure is removed, a first accommodating space is formed, and the pseudo gate structure is fixed on the substrate based on the pseudo fin part; forming a bottom channel isolation structure in the first accommodating space; a gate structure is formed in the space occupied by the dummy gate structure, and the performance of the gate-all-around transistor is improved.

The utility model relates to the cable field, and especially relates to a multichannel isolation shielding cable comprising a cable core, a composite shielding layer, a filling layer and a protection layer, the composite shielding layer wraps the cable core, and the filling layer is filled between the composite shielding layer and the protection layer; the composite shielding layer comprises an inner shielding layer, an insulating layer and a shielding tape layer, the inner shielding layer wraps the outer side of the cable core, the insulating layer wraps the outer side of the inner shielding layer, the shielding tape layer wraps the insulating layer, and a bonding layer is arranged on the side, making contact with the insulating layer, of the shielding tape layer. According to the utility model, near-field coupling and frequency band cross interference among the wire cores can be effectively reduced, and the anti-interference capability of the cable is significantly improved.

The invention relates to a VxWorks hybrid message transmission method based on dual-channel isolation and dynamic traffic shaping, and belongs to the technical field of embedded real-time operating system communication. According to the transmission method of the mixed message in the VxWorks system, the UDP message delay jitter and the UDP message packet loss rate are effectively reduced, the bandwidth utilization rate of the TCP message is improved, and a standardized solution of mixed flow cooperative transmission is provided for the VxWorks system.

The invention discloses a multi-channel L-band transmitting device, which comprises a transmitting unit, a monitoring unit and a power supply and control unit, the transmitting unit and the monitoring unit are respectively connected with the power supply and control unit, the transmitting unit comprises a plurality of channels which are designed into independent sub-cavities, and each channel is independently controlled in amplitude and phase; the monitoring unit has various monitoring functions including temperature, current and voltage; the power supply and control unit has various instruction functions including operation, storage and programming. According to the invention, 16-channel input and 5-beam output are adopted, single-channel independent amplitude-phase control is realized, and channel independent cavity division design is realized, so that channel isolation and amplitude-phase control precision is improved.

The application discloses a kind of mixed multimode E-band duplexers and manufacturing method thereof, it is related to microwave communication passive device field.The device of the application includes: cavity and the flat cover plate of bonding and fixed;It is internally provided with the resonant cavity of multimode mixed row.The bottom surface and top surface of second mode resonant cavity are flat plane, and the orthogonal mode polarization is excited to occur overturn by the proportion mismatch of length and width size on cross section, and transmission zero point is constructed to corresponding frequency polarity without three-dimensional boss.Adjacent resonant cavities are coupled by the side window of single-side isolation rib, and the top of isolation rib is flush with the cavity package surface and sealed with the cover plate.The application can be directly numerical control forming using flat bottom cutting process, eliminates assembly debugging and gap leakage hidden danger, realizes the free adjustment assembly of device from hardware and algorithm source, and the insertion loss of the prepared duplexer is as low as 0.31dB in actual measurement, and the channel isolation is better than 77dB, suitable for efficient mass production.

This invention belongs to the field of semiconductor packaging and antenna technology, specifically an AiP packaged antenna structure and fabrication method that is easy to mass-produce, including a substrate layer, a redistribution layer, a molding insulating layer, and an antenna radiating layer; characterized in that a vertical coaxial interconnect component is embedded in the molding insulating layer, which includes a central signal conductor, an inner dielectric sleeve, and a metal shielding wall; the central signal conductor connects to the signal path, and the metal shielding wall connects to the ground plane to form a closed electromagnetic channel; through the above solution, this application achieves precise control of characteristic impedance, improves channel isolation, reduces transmission loss, and improves mass production yield through modular technology.

This invention relates to a dual-channel third-order dielectric filter, comprising an orthogonal right-angled metal cavity containing orthogonally arranged first, second, and third dual-mode dielectric resonators. The first dual-mode dielectric resonator is located at the orthogonal intersection point and cascaded with the coupling windows of the second and third dual-mode dielectric resonators. The filter has input and output port groups at the bottom of the metal cavity, with the input port group cooperating with the output port group via the three resonators. By setting the three orthogonally arranged and cascaded resonators, the two filter channels share the first dual-mode dielectric resonator, reducing the number of resonators and lowering the overall size and weight while ensuring filtering performance. Simultaneously, first and second dielectric strips of equal height are provided at the cross-angle of the second and third dual-mode dielectric resonators to suppress higher-order spurious modes, improve channel isolation, overcome the difficulty in controlling electromagnetic coupling in discrete solutions, and simplify the assembly process through integrated design.

3D memory array devices and methods of manufacturing are described herein. A method includes etching a first trench and a second trench in a multilayer stack, the multilayer stack including alternating dielectric layers and sacrificial layers. The method further includes forming a word line by replacing a sacrificial layer with a conductive material. Once the word line has been formed, a first transistor is formed in the first trench, the first transistor including a first channel isolation structure. A cut channel plug is formed in the second trench, a centerline of the cut channel plug being aligned with a centerline of the channel isolation structure. The method further includes forming a second transistor in the second trench adjacent the cut channel plug, the word line being electrically coupled to the first transistor and the second transistor.

The invention relates to the technical field of antennas, in particular to a K-Ka double-frequency common-caliber satellite communication active phased-array antenna which comprises an antenna array plane and TR assembly integrated plate, a metal heat conduction structure cavity, a wave control assembly and power supply assembly integrated plate, a metal heat conduction structure cover plate and the like. The antenna array plane and TR assembly integrated plate serves as a core carrier, spatial multiplexing of a transmitting frequency band (Ka) and a receiving frequency band (K) in the same physical caliber is achieved through a nested double-frequency layout and a multi-layer shielding structure, Ka-frequency-band transmitting arrays are concentrated in the center in a # shape, K-frequency-band receiving arrays surround the periphery, high-frequency-band small spacing is adapted, grating lobes are avoided, and the antenna array plane and the TR assembly integrated plate are integrated. Meanwhile, the three-layer PCB structure (the receiving link radio frequency wiring layer, the grounding inner layer and the transmitting link radio frequency wiring layer) is shielded through the grounding inner layer, and the copper surface isolation frame is combined, so that the isolation degree of a transmitting channel and a receiving channel can be improved, and the problem of high-frequency interference in an application scene of low-orbit satellite terminal equipment is effectively solved.

The application discloses a method and a model construction method for coil decoupling based on butterfly coil current mode, which comprises the following steps: setting two butterfly coils as an initial overlapping state in which the middle conductors are collinear and partially coincide in the collinear direction; adjusting the relative spatial pose of the two coils and monitoring the resonant frequency of the coupling part in real time; when the common-mode resonant frequency and the differential-mode resonant frequency in the resonant frequency tend to be consistent, the current pose is determined as the target decoupling pose. The coupling problem of the butterfly coil array is solved, and no additional decoupling circuit is needed. Efficient decoupling can be realized only by pure structural adjustment, the channel isolation and parallel imaging performance are significantly improved while the near-field advantage of the butterfly coil is maintained.

The invention discloses an MCU-based multi-station parallel automatic test system and method, and belongs to the technical field of semiconductor discrete device environment test. The system comprises a core control unit used for executing system initialization, channel selection control, test data processing and working mode switching; the channel isolation control unit comprises a plurality of paths of independent optocoupler isolation circuits; the man-machine interaction unit comprises a key input module and a state display module; the test execution unit comprises a path switching module and a parameter tester; the parameter tester is used for carrying out electrical performance parameter detection on the tested product accessed into the loop; the data interaction unit comprises a communication module and upper computer software; the upper computer software is used for receiving, storing and processing test data; according to the invention, the test efficiency of 80 devices can be improved within one minute, and the batch test requirement is met; the tested device does not need to be taken out from the high-low temperature test box, frosting and data deviation caused by manual operation are avoided, and the test result is more stable and accurate.

The embodiment of the invention provides a data synchronization method and system based on an isolation area, and belongs to the technical field of information security technologies. The method comprises the following steps: generating a safety control parameter used for identifying a transmission constraint as a channel entrance of cross-environment data interaction; extracting to-be-synchronized data of the target service according to the security control parameter in the source environment, generating an encrypted data packet conforming to the transmission constraint, and writing the encrypted data packet into an isolation area communication channel; reading the encrypted data packet from the isolation area communication channel according to the security control parameter in the target environment, performing identity verification and content decryption on the encrypted data packet to obtain synchronous data for service updating, and generating corresponding receipt information to be fed back to the isolation area communication channel; and the isolation area communication channel transmits the synchronization data to the target business process based on the receipt information. According to the scheme of the invention, data security synchronization and state verifiable transmission between the development test network and the production office network are realized.

The invention provides a multichannel isolated thermocouple acquisition system, which relates to the technical field of thermocouple temperature detection and comprises a control board card and a thermocouple acquisition board card. The control board card comprises a microcontroller unit, an FPGA unit and a power supply unit, the FPGA unit is in communication connection with an external controller, and the power supply unit is used for supplying power; an analog switch circuit in the thermocouple acquisition board card is respectively connected with a cold junction compensation channel and a plurality of independent thermocouple acquisition channels, the analog switch circuit is in communication connection with a microcontroller unit through an SPI bus, and the thermocouple acquisition channels are used for acquiring thermocouple signals of various different types; the microcontroller unit is used for processing thermocouple signals and sending the thermocouple signals to an external controller through the FPGA unit. The system supports multi-point temperature acquisition and electrical isolation between acquisition channels, is compatible with various thermocouple types, meets industrial requirements, improves system reliability, separates system control and communication functions, and improves the overall performance of the system.

Described herein are systems for vector modulated beamforming that may be implemented in a space-efficient manner and with high channel isolation. In some embodiments, systems described herein may perform I / Q vector modulation downstream of receive signal summation and / or upstream of transmit signal division. Implementing I / Q modulation on a transmit signal prior to dividing the transmit signal among multiple transmit channels, and / or on a receive signal after multiple receive channels have been summed to form the receive signal, may use fewer I / Q modulators than channels, such as a single I / Q modulator. Having fewer I / Q modulators than channels results in a space-efficient beamforming architecture having low channel crosstalk and / or permits use of a simple I / Q modulator calibration procedure. Alternatively or additionally, in some embodiments, channel summing and / or dividing circuitry in systems described herein may be coupled between amplification circuitry and I / Q vector modulation circuitry to advantageously use fewer I / Q modulators than channels.