Manufacturing method of rigid-flexible combined board

Abstract

The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a rigid-flexible combined board. According to the invention, the press-fit structureis changed and a pp window does not need to be formed in a prepreg in the press-fit process; a PI protective film is attached to a pre-cutting area. During the press-fit process, the prepreg does notneed to be contracted inwards, so that the sufficient flowing adhesive is provided to ensure the bonding effect of the rigid-flexible layer and a problem of overflowing of the excessive flowing adhesive to the pp window, that is, binding to the flexible area is solved. Besides, with no PP window, a flatness problem of protruding or recession on the press-fit surface due to the window height falling difference caused by the PP window in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a rigid-flex board. Background technique [0002] Rigid-flex boards, also known as soft-rigid boards, are composed of rigid boards and flexible boards that are selectively laminated together. Its structure is tight, and metallized holes are used to form conductive connections. The printed circuit board combining rigid and flexible materials makes full use of the characteristics of the flexible board and solves the problem of electrical connection with the rigid board. The flexible bonded board can be moved, bent, folded, twisted, and realize three-dimensional wiring, which greatly saves the installation space of electronic components and complies with the development trend of "light, thin, short, and small" electronic products. , aerospace, automotive electronics, medical electronics, consumer electronics and many other fields have been ...

AI Technical Summary

Problems solved by technology

[0008] When the rigid layer and the flexible layer are stacked together, such as figure 1 As shown, in order to ensure the lamination effect between the flexible layer and the rigid layer, the size of the cover film needs to be larger than the flexible area, that is, the edge of the cover film needs to enter between the interlayers, generally 0.5-1.0mm. At the same time, in order to To prevent the PP glue overflowing to the flexible area from affecting the performance and appearance of the product, it is necessary to design the shrinkage of PP, and set the size of the PP window to be larger than the flexible area. However, this design method has the following defects: 1. If the pp window is opened, the glue will continue to flow to the gap during pressing. If the glue overflows too much, it will easily cause the surface of the board to protrude, while if the glue overflows too small, it will cause depressions, which will affect the production and appearance of the outer circuit. 2. Covering film It is difficult to ensure the bonding effect between the flexible layer and the rigid layer in the part that does not overlap with PP, which affects the flexural performance of the product, and the rigid-flexible joint position is easy to be torn during subsequent use

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