Three-dimensional fan-out type packaging structure of ultrahigh-density multi-chip module and preparation method
An ultra-high-density, packaging structure technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problem that the three-dimensional fan-out packaging structure cannot be applied to ultra-high-density multi-chip modules , to achieve the effect of improving packaging integration and simplifying the process
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Embodiment 1
[0084] Such as figure 1 as shown,
[0085] A three-dimensional fan-out packaging structure of an ultra-high-density multi-chip module, including a device chip 3 plastic-sealed by a first plastic package 4, the pins of the device chip 3 are exposed from the first plastic package 4, and the device chip 3 is close to the first plastic package. The pins on the periphery of the plastic package 4 are connected to the metal interconnection column 6 in the second plastic package 8, and the pins of the device chip 3 near the center of the first plastic package 4 are connected to the interconnection chip 7 in the second plastic package 8, and the interconnection chip 7 is The second plastic package 8 is completely wrapped, the metal interconnection column 6 is exposed to the second plastic package 8, and the side of the second plastic package 8 away from the first plastic package 4 is provided with a rewiring layer 9 adapted to the exposed metal interconnection column 6 , solder balls ...
Embodiment 2
[0089] A method for preparing a three-dimensional fan-out packaging structure of an ultra-high-density multi-chip module, comprising the following steps:
[0090] 1) if figure 2 As shown, a layer of temporary bonding adhesive layer 2 is coated on the upper surface of the temporary carrier 1;
[0091] 2) if image 3 As shown, the device chip 3 that needs to be interconnected and packaged is mounted on the temporary bonding adhesive layer 2, and the device face of the device chip 3 faces the temporary bonding adhesive layer 2;
[0092] 3) if Figure 4 As shown, then the mounted device chip 3 is plastic-encapsulated to form the first plastic package 4;
[0093] 4) if Figure 5 As shown, the side of the first plastic package 4 away from the temporary carrier 1 is thinned, so that the pins on the back of the device chip 3 are exposed;
[0094] 5) if Figure 6 As shown, for the pins on the device chip 3 near the periphery of the first plastic package 4, the metal interconnect...
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