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Sealing film

A technology of encapsulation film and encapsulation layer, which is applied in the direction of electrical components, circuits, layered products, etc., can solve the problems such as OLED bright spots, achieve the effect of preventing bright spots and improving processing efficiency

Active Publication Date: 2020-01-17
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is the issue of OLED bright spots due to possible outgassing inside the OLED device

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] Fabrication of the magnetic layer

[0106] Fe particles (particle diameter about 1 μm to 10 μm, sheet type) as magnetic particles and acrylic resin as binder resin were mixed at a weight ratio of 90:10 (magnetic particles: binder resin) to prepare dilute with toluene solution (solids content 50%).

[0107] The solution prepared above was applied to the release surface of the release PET using a comma coater, and dried in a dryer at 130° C. for 3 minutes to form a magnetic layer with a thickness of 30 μm.

[0108] Manufacture of encapsulation layer

[0109] A CaO (average particle diameter 3 μm) solution (solid content 50%) was prepared as a moisture adsorbent. Separately, a solution (solid content 50%) in which 200 g of butyl rubber resin (BT-20, Sunwoo Chemtech) and 60 g of DCPD petroleum resin (SU5270, Sunwoo Chemtech) were diluted with toluene was prepared, and then the solution was homogenized. Introduce 10 g of photocuring agent (TMPTA, Miwon) and 15 g of ph...

Embodiment 2

[0116] An encapsulation film was produced in the same manner as in Example 1, except that in the production of the magnetic layer, Fe particles (particle diameter about 1 μm to 10 μm, flake type) as magnetic particles and Ni particles as bright spot suppressors were used. (Particle diameter about 300nm) was mixed at a weight ratio of 9:1, and acrylic resin as a binder resin was mixed with magnetic particles and bright spot suppressor at a ratio of 90:10 (magnetic particle + bright spot suppressor: binder resin) were mixed in a weight ratio of toluene to prepare a solution diluted with toluene (50% solid content), and then a magnetic layer was formed.

Embodiment 3

[0118] An encapsulation film was manufactured in the same manner as in Example 2, except that the magnetic particles and the bright spot suppressor were mixed in a weight ratio of 6:4.

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Abstract

The present application relates to a sealing film, a method for preparing same, an organic electronic device comprising same and a method for preparing an organic electronic device using same. Provided is a sealing film which enables forming of a structure blocking moisture or oxygen from flowing into an organic electronic device from outside, effective emission of heat accumulates inside the organic electronic device, and prevention of bright spots generated on the organic electronic device.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims the benefit of priority based on Korean Patent Application No. 10-2017-0072501 filed on June 9, 2017, the disclosure of which is incorporated herein by reference in its entirety. technical field [0003] The present application relates to encapsulation films and organic electronic devices comprising the same. Background technique [0004] An organic electronic device (OED) means a device including an organic material layer that generates an alternating current of charges using holes and electrons, and examples thereof may include photovoltaic devices, rectifiers, emitters, organic light emitting diodes (OLEDs), and the like. [0005] Organic light emitting diodes (OLEDs) among the above organic electronic devices have lower power consumption and faster response speed than existing light sources, and are advantageous for thinning display devices or lighting devices. In addi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52B32B7/02B32B7/12B32B27/20
CPCB32B7/02B32B7/12B32B27/20H10K50/8423H10K50/8426H10K50/844H10K50/846B32B2307/208B32B2307/302H01L33/56H01L33/644H01L23/295H10K50/841H10K71/00
Inventor 柳浩俊柳东桓申世镐申汶哲郑燻柳在说
Owner LG CHEM LTD
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