Shell, shell manufacturing method and electronic device

A shell and membrane layer technology, which is applied in the field of electronics and information, can solve the problems of low bonding rate of film layers and high process complexity, and achieve the effect of reducing process complexity and improving bonding rate

Active Publication Date: 2021-05-18
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the manufacturing process of the casing in the related art is relatively complex, and the adhesion rate between the film layers of the casing is not high at the same time.

Method used

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  • Shell, shell manufacturing method and electronic device
  • Shell, shell manufacturing method and electronic device
  • Shell, shell manufacturing method and electronic device

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Embodiment Construction

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0036] It should be understood that references to "an embodiment of the present application" or "the foregoing embodiment" throughout the specification mean that a specific feature, structure or characteristic related to the embodiment is included in at least one embodiment of the present application. Therefore, appearances of "in the embodiment of the present application" or "in the foregoing embodiment" throughout the specification do not necessarily refer to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments. In various embodiments of the present application, the serial numbers of the above-mentioned processes do not mean the order of execution, and the execution order ...

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Abstract

The embodiment of the present application discloses a casing, which includes: a substrate layer, a diaphragm layer, and the diaphragm layer is arranged on the upper surface of the substrate layer; wherein, the diaphragm layer includes a film layer and a A texture layer on the upper surface of the film layer; the substrate layer and the film layer have the same material; and a covering layer, the covering layer is arranged on the upper surface of the film layer. The embodiment of the present application also discloses a manufacturing method of the housing and electronic equipment.

Description

technical field [0001] The present application relates to the field of electronics and information technology, and in particular to a casing, a manufacturing method of the casing, and electronic equipment. Background technique [0002] With the development of information technology, the appearance of electronic equipment has attracted more and more attention from users, and it has become the basic demand of users to present high-quality shells through nano-scale texture patterns; in related technologies, it will have nano-scale The master mold of the texture pattern is transferred to the film sheet, and the transferred film sheet is molded and injected through the injection molding process, and the film sheet needs to be peeled off after the injection molding is completed. It can be seen that in the related art, the process complexity of manufacturing the housing is relatively high, and at the same time, the adhesion rate between the film layers of the housing is not high. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02B44C5/04B44C3/02
CPCB44C3/02B44C5/04H05K5/0243
Inventor 彭明杰郑秀蓝辛亚纯高为清张韶耽
Owner LENOVO (BEIJING) LTD
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