High-speed flexible circuit boards, optical components and optical modules

Abstract

The invention relates to a high-speed flexible circuit board, an optical assembly and an optical module. According to the high-speed flexible circuit board of the invention, a first channel is arranged between a first signal through hole and a grounding through hole; the first channel end of the first channel contacts with a first anti-bonding pad; the second channel end of the first channel is arranged between a first grounding end and a second grounding end; a second channel is arranged between a second signal through hole and a grounding through hole; the third channel end of the second channel contacts with a second anti-bonding pad; the fourth channel end of the second channel is arranged between the first grounding end and the second grounding end; and therefore, when a TO packagingoptical assembly is used for transmitting high-speed signals, a resonant frequency can be moved to a higher frequency band through the first channel and the second channel, and therefore, the ground plane influence of resonance is reduced, and the condition that the resonance frequency falls into a communication frequency band and causes interference to the transmission of the high-speed signals can be avoided; and thus, the TO packaging optical assembly can be applied to a high-speed and ultra-high-speed optical module and can assist in decreasing the cost of the high-speed and ultra-high-speed optical modules.

Description

technical field [0001] The present application relates to the technical field of optical communication, and in particular, to a high-speed flexible circuit board, an optical component and an optical module. Background technique [0002] With the development of communication technology, 5G (5th Generation Mobile Networks, fifth generation mobile communication technology) communication technology has emerged. In order to meet the needs of 5G wireless fronthaul and ultra-large broadband data centers, the rate of optical transceiver modules is getting higher and higher. 25Gbps (gigabits per second) optical modules are widely used in 5G wireless fronthaul. [0003] The packaging forms often used for optical modules are TO packaging and BOX packaging. like figure 1 As shown, taking a TO-packaged semiconductor laser as an example, a TO laser is formed by combining a cap, a laser chip, a carrier and a stem. TO packaging has low cost and simple process, and is the mainstream pack...

AI Technical Summary

Problems solved by technology

However, the packaging process requirements of BOX packaging are high, resulting in a low yield rate of devices in BOX packaging, which in turn increases the cost of optical modules

[0005] That is, during the implementation process, the inventors found that there are at least the following problems in the traditional technology: the packaging process of the current high-speed or ultra-high-speed optical modules is too complicated and the cost is too high

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