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Manufacturing method of flexible packaging structure and wearable device

A technology of flexible packaging and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices. Good, low manufacturing difficulty, and the effect of reducing the difficulty of connection

Active Publication Date: 2020-01-31
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the manufacturing cost of flexible FPC is high. Due to problems such as warpage, uneven surface, and assembly accuracy, the injection molding and packaging process of the flexible substrate after the assembly of the surface components is very difficult.

Method used

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  • Manufacturing method of flexible packaging structure and wearable device
  • Manufacturing method of flexible packaging structure and wearable device
  • Manufacturing method of flexible packaging structure and wearable device

Examples

Experimental program
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Embodiment Construction

[0027] In order to further explain the technical means and functions adopted by the present invention to achieve the intended invention purpose, the detailed description is as follows in conjunction with the accompanying drawings and preferred embodiments.

[0028] The invention provides a flexible packaging structure, a manufacturing method of the flexible packaging structure and a wearable device with the flexible packaging structure. The flexible packaging structure can be applied to large-scale production, and has good flexibility, low cost, strong reliability and low manufacturing difficulty.

[0029] figure 1 The schematic diagram of the cross-sectional structure of the flexible packaging structure provided by the embodiment of the present invention, figure 2 for figure 1 Schematic diagram of the cross-sectional structure of the functional structure, image 3 for figure 1 Schematic diagram of the top-view structure of the functional structure, Figure 4 for figure...

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PUM

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Abstract

The invention provides a manufacturing method of a flexible packaging structure. The method comprises the steps that a functional component is covered with a covering layer to form a functional module; functional modules are electrically connected through flexible wiring to form a functional structure; a packaging film is provided, and on the packaging film, a number of accommodating grooves matching the functional modules in shapes are formed on the packaging film; and the functional structure is fixed on the packaging film , and the functional modules are arranged in the accommodating grooves. The flexible packaging structure manufactured by the manufacturing method of the flexible packaging structure can be applied to large-scale production, and has the advantages of good flexibility, low cost, high reliability, and low manufacturing difficulty.

Description

[0001] This application is a divisional application of the invention patent application entitled "Flexible Packaging Structure, Manufacturing Method and Wearable Device" with the filing date of July 20, 2018 and the application number of 201810806451.2. technical field [0002] The invention relates to the field of semiconductor system-level packaging, in particular to a method for manufacturing a flexible packaging structure and a wearable device with the flexible packaging structure. Background technique [0003] In recent years, wearable devices have become more and more popular, and wearable devices have been used more and more in fields such as soldiers' field operations or training, athlete training, physical fitness monitoring of exercisers, and health monitoring. In order to collect information more accurately, how to make wearable devices flexible so that they can be closer to the curve of the human body itself has become the focus of major manufacturers and laborato...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/60H01L23/49H01L23/31
CPCH01L23/3114H01L23/49H01L21/563H01L24/85H01L2224/85986H01L2224/18
Inventor 龚云平
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG