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Heating device for heat conduction performance characterization of material

A heating device and heat conduction technology, applied in electric heating devices, material thermal conductivity, heating element materials, etc., can solve the problems of high equipment cost, uneconomical and high cost, and achieve the effect of good sealing performance

Active Publication Date: 2020-01-31
CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the use of these methods for testing has the disadvantages of long time consumption and high cost; the structure of the test device is relatively complicated, the cost of equipment is high, and the operation is relatively cumbersome
However, in the process of teaching and testing, sometimes it is only necessary to roughly evaluate the thermal conductivity of materials. At this time, it is obviously not economical to use traditional equipment and methods.

Method used

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  • Heating device for heat conduction performance characterization of material
  • Heating device for heat conduction performance characterization of material
  • Heating device for heat conduction performance characterization of material

Examples

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Embodiment Construction

[0036] The present invention will be further described below in conjunction with the embodiments and accompanying drawings.

[0037] Such as Figure 1 to Figure 7 Shown:

[0038] A heating device for characterization of thermal conductivity of materials, comprising a spherical heat-conducting shell 11, a hollow cavity 1a is provided in the heat-conducting shell 11, a support hole 11a is penetrated on the wall of the heat-conducting shell 11, and The support hole 11a is pierced with a strut 12, the outer end of the strut 12 protrudes from the heat conducting shell 11, the inner end of the strut 12 protrudes into the hollow cavity 1a and is connected with a heating component 13, A gap is provided between the heating component 13 and the inner wall of the heat conducting housing 11 . In order to make the heat conduction shell 11 quickly form a uniform isothermal body, the heat conduction shell 11 is a copper ball shell.

[0039] The strut 12 includes a strut body 121 , the str...

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PUM

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Abstract

The invention discloses a heating device for the heat conduction performance characterization of a material. The heating device comprising a spherical heat conduction shell; a hollow cavity is formedin the heat conduction shell; a supporting hole penetrates through the wall of the heat conduction shell; a supporting rod penetrates through the supporting hole; the outer end of the supporting rod extends out of the heat conduction shell; the inner end of the supporting rod extends into the hollow cavity and is connected with a heating assembly; and a gap is formed between the heating assembly and the inner wall of the heat conduction shell. With the heating device adopted, a uniform and stable test heating source can be provided during the characterization and measurement of the heat conduction performance of the material. The heating device has good sealing performance and can be applied to the heat conduction measurement of solid, liquid and gas media.

Description

technical field [0001] The invention relates to a heat conduction measurement device, in particular to a component used for a material heat conduction capability characterization device. Background technique [0002] Thermal conductivity is a measure to characterize the thermal conductivity of materials, which plays an important guiding role in production, life and engineering applications. At present, the methods for testing the thermal conductivity of materials include the heat flow method, the hot plate method, the laser lightning method, the transient plane heat source method, etc., and the test device is adaptable to various test methods. However, the use of these methods for testing has the disadvantages of long time consumption and high cost; the structure of the test device is relatively complicated, the cost of the equipment is high, and the operation is relatively cumbersome. However, in the process of teaching and testing, sometimes it is only necessary to roughl...

Claims

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Application Information

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IPC IPC(8): H05B3/00H05B3/06H05B3/02H05B3/10G01N25/18
CPCG01N25/18H05B3/00H05B3/02H05B3/06H05B3/10
Inventor 张倩影徐屾朱光俊朱礼龙
Owner CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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