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Solid medium thermal conductivity measurement device

A measuring device and solid medium technology, which is applied in the field of characterization devices for the thermal conductivity of materials, can solve the problems of high cost, complex structure of the test device, cumbersome operation, etc.

Active Publication Date: 2021-12-03
CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of these methods for testing has the disadvantages of long time consumption and high cost; the structure of the test device is relatively complicated, the cost of equipment is high, and the operation is relatively cumbersome
In the process of teaching and testing, sometimes it is only necessary to roughly evaluate the thermal conductivity of the material. At this time, it is obviously not economical to use traditional equipment and methods.
[0003] For different media (solid, liquid, gas), the specific requirements for the measuring device are different. For example, the measuring device for gas and liquid materials has higher sealing performance than solid materials, and the gas is not easy to be completely filled.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Such as figure 1 , 2 , 3, a solid medium thermal conductivity measurement device, including a box a and a control display module 3, the box a is provided with a heat source 1 and a first temperature sensing module 2, the heat source 1 and the first temperature sensing module The modules 2 are arranged at intervals, and the heat source 1 and the first temperature sensing module 2 are connected to the control display module 3;

[0055] The top of the box body a is provided with a feed opening, the bottom of the box body a is provided with a discharge opening, the discharge opening is covered with a baffle plate a1, and the feed opening is covered with a shielding plate a5, so A return hopper a3 is provided below the box body a.

[0056] The side wall of the box body a is provided with a material baffle socket corresponding to the material baffle a1, and the inner wall of the box a is provided with a material baffle slot corresponding to the material baffle a1. The mate...

Embodiment 2

[0089] Use the above device to carry out constant temperature heating, and use the specific steps of method ① as follows:

[0090] Step 1, storing the material to be tested and the box a at room temperature (25° C.) for at least 24 hours, so that the temperature of the material to be tested and the box a is consistent with room temperature;

[0091] Step 2. At room temperature, heat the heat source 1 to the target temperature and maintain it, and put the material to be tested into the box a from the feeding port within a predetermined time, so that the box a is filled with the material to be tested;

[0092] Step 3, taking the time when the material to be tested is started to be added as the initial moment, continuously acquire and record the temperature data measured by the first temperature sensing module 2 until the temperature measured by the first temperature sensing module 2 is stable, and plot the temperature - time curve; due to the constant temperature heating, the th...

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Abstract

The invention discloses a device for measuring thermal conductivity of a solid medium, which includes a box body and a control display module. The box body is provided with a heat source and a first temperature sensing module. The heat source and the first temperature sensing module are arranged at intervals. The heat source, the first temperature sensing module The first temperature sensing module is connected with the control display module; the top of the box is provided with a feeding port, the bottom of the box is provided with a discharge port, and the discharge port is covered with a material blocking plate, the A return hopper is provided below the box body. The remarkable effect of adopting the invention is that the structure is simple, the operation is simple and fast, and the heat conduction effect of the material can be measured and analyzed simply and quickly, so as to roughly measure the heat conduction performance of the material.

Description

technical field [0001] The invention relates to a heat conduction measuring device, in particular to a characterization device for the thermal conductivity of a material. Background technique [0002] Thermal conductivity is a measure that characterizes the thermal conductivity of materials, and plays an important guiding role in production, life and engineering applications. At present, the methods for testing the thermal conductivity of materials include heat flow method, hot plate method, laser lightning method, transient plane heat source method, etc., and the test device is adaptable to various test methods. However, the use of these methods for testing has the disadvantages of long time consumption and high cost; the structure of the test device is relatively complicated, the cost of equipment is high, and the operation is relatively cumbersome. In the process of teaching and testing, sometimes it is only necessary to roughly evaluate the thermal conductivity of the m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20G01N25/18
CPCG01N25/18G01N25/20
Inventor 朱礼龙朱光俊张倩影徐屾
Owner CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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