Flexible electronic system capable of automatically adjusting binding force

Abstract

The invention provides a flexible electronic system capable of automatically adjusting binding force. The flexible electronic system comprises a deformable flexible substrate, a heating device and a volatile substance, the deformable flexible substrate comprises a film-based substrate and a combined body array, the combined body array is used for being in contact with a combined object and applying binding force; the film-based substrate bears the combined body array and can deform under pressure; a sealed liquid cavity is formed in the deformable flexible substrate; volatile substances are accommodated in the liquid cavity; the volatile substances are in a liquid state at the normal temperature, a heating device is borne by other parts, except the film-based substrate and the combined body array, of the deformable flexible substrate, when the heating device emits heat, the volatile substances are heated and volatilized into a gas state, the film-based substrate bulges towards the exterior of the liquid cavity, and the combined body array deforms, so that the binding force is reduced. The flexible electronic system capable of automatically adjusting the binding force has the characteristic of automatic regulation and control, and can be conveniently separated from the combined object without damaging internal electronic devices.

Description

technical field [0001] The invention relates to the technical field of electronic information, and in particular to a flexible electronic system capable of self-adjusting the strength of binding force. Background technique [0002] Inorganic flexible electronics technology refers to the structural design of mechanics and other aspects to make traditional inorganic semiconductor devices soft and extensible, which are usually composed of substrates and functional units, and have been widely used in recent years. In flexible electronic systems, the flexible substrate as the carrier of the device is extremely important for the entire flexible electronic system. The role of traditional flexible substrates is often limited to supporting and carrying components, and when it needs to be combined with the object to be measured, it needs to be combined with additional technical means, such as surgical suture or adhesive bonding . Adoption of this passive combination method not only ...

AI Technical Summary

Problems solved by technology

None of these methods can achieve autonomous adjustment of the binding force. Although some binding properties are very good, it is particularly difficult to remove the flexible electronic system from the binding object, and even the upper circuit is damaged due to forceful tearing.

Moreover, the methods for modifying flexible substrates are complicated to operate and have limited effects.

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