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Grinding device, grinding method and computer storage medium

A technology of grinding and grinding parts, which is applied in the direction of grinding devices, parts of grinding machine tools, and machine tools suitable for grinding workpiece planes, etc. It can solve the problems of reduced bending strength and needs, and achieve the goal of improving the bending strength Effect

Pending Publication Date: 2020-02-18
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, since the knife marks reduce the bending strength of the devices divided by dicing the wafer, for example, countermeasures against the knife marks are required.

Method used

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  • Grinding device, grinding method and computer storage medium
  • Grinding device, grinding method and computer storage medium
  • Grinding device, grinding method and computer storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0089] Next, another embodiment of the grinding device 30 will be described.

[0090] (1st modified example)

[0091] In the above embodiments, the relationship between the outer diameters D1, D2, and D3 of the grinding wheels 280, 290, and 300 is D3>D1=D2, but as Figure 7 As shown, the outer diameter D1 of the rough grinding wheel 280, the outer diameter D2 of the middle grinding wheel 290, and the outer diameter D3 of the fine grinding wheel 300 may all be different. In this case, the tool marks formed on the back surface of the wafer W by rough grinding, medium grinding, and finish grinding can all have different shapes, so that the bending strength of the wafer W and the device can be further improved. In addition, when making the outer diameters D1, D2, and D3 different in this way, it is preferable to increase in the order of D1, D2, and D3 (D3>D1>D2).

[0092] However, the inventors of the present invention conducted intensive studies and found that among the tool ma...

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Abstract

This grinding device for grinding a substrate comprises substrate holding units which hold the substrate, and annular grinding units which contact at least the center and the periphery of the substrate held by the substrate holding units and grind said substrate, wherein a plurality of the substrate holding units and of the grinding units are provided, and the diameter of at least one of the plurality of grinding units is different from the diameter of the other grinding units.

Description

technical field [0001] (Cross-reference of related application) [0002] This application claims priority based on Japanese Patent Application No. 2017-136026 for which it applied to Japan on July 12, 2017, and uses the content here. [0003] The invention relates to a grinding device for grinding a substrate, a grinding method using the grinding device, and a computer storage medium. Background technique [0004] In recent years, in the manufacturing process of semiconductor devices, a semiconductor wafer (hereinafter referred to as a wafer) on which a plurality of electronic circuits etc. . [0005] The grinding of the back surface of the wafer is performed by a grinding device including: a chuck that holds, for example, the surface of the wafer and can rotate freely; A grinding wheel has a ring shape and is configured to be rotatable. In this grinding apparatus, the back surface of the wafer is ground by pressing the grinding wheel against the back surface of the wafe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304B24B7/04B24B49/12
CPCB24B7/04B24B49/12H01L21/304B24B7/228H01L22/12H01L21/67092H01L21/67253H01L21/67288B24B37/20B24B37/005H01L22/26
Inventor 田村武児玉宗久
Owner TOKYO ELECTRON LTD