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Evaporation mechanism

A technology of vapor deposition material and motion mechanism, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve problems such as thick substrates, avoid restrictions, prevent plug holes, and prevent particles from falling Effect

Pending Publication Date: 2020-02-21
FUJIAN HUAJIACAI CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, it is necessary to provide an evaporation mechanism to solve the problem that the existing evaporation mechanism requires a thicker substrate

Method used

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Embodiment Construction

[0031] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0032] see figure 1 , the technology before the improvement generally adopts the substrate 100 on top and the crucible 102 of the evaporation source on the bottom during evaporation; since the substrate only has the edge non-evaporation area supported by the substrate support 101, and there is no support structure in the middle, it is inevitable will bend. The larger the size of the substrate, the thinner the thickness of the substrate, and the greater the curvature; the curvature limits the size and thickness of the substrate, which is not conducive to the improvement of production efficiency and cost savings.

[0033] see figure 2 , the present invention provides a new evaporation mechanism, which is characterized in that the sub...

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Abstract

The invention provides an evaporation mechanism. The evaporation mechanism comprises a crucible and a dustproof device, wherein the crucible is arranged above the dustproof device, the interior of thecrucible is filled with an evaporation material, a heating device wraps the outer wall of the crucible, a porous dispersion plate is arranged at the middle part of the crucible, a nozzle used for allowing the evaporation material to spray out is arranged on the side wall of the upper part of the crucible, the nozzle communicates with the interior of the crucible, the nozzle inclines downwards andpoints to a base plate placement platform arranged at one side of the lower part of the dustproof device, the bottom surface of the base plate placement platform is a plane, and a mask and a to-be-evaporated base plate are sequentially arranged on the base plate placement platform from top to bottom. With the evaporation mode that the base plate is arranged above and the evaporation mechanism isarranged below, the base plate is integrally supported by the base plate placement platform, the base plate is prevented from being bent, so that the limitation of bending on thickness and size of thebase plate is prevented; and meanwhile, by the dustproof device, particles can be effectively prevented from falling off, so that hole plugging of the mask is prevented.

Description

technical field [0001] The invention relates to the technical field of evaporation equipment, in particular to an evaporation mechanism. Background technique [0002] Organic Light-Emitting Diode (OLED) has attracted the attention of the industry since it was invented. Development prospects of display technology. [0003] The core part of OLED is composed of multi-layer organic layers with different functions, and the thickness of these organic layers is generally in arrive In between, the thickness of each layer must be precisely controlled; at present, the physical vapor deposition method is the mainstream technology for making organic layers: the organic material is heated in a vacuum chamber to vaporize or sublimate the material and deposit it on a substrate with a relatively low temperature. OLED devices that form multilayer films. [0004] The more common practice is: the substrate is in the upper part of the vacuum chamber with the coating facing down, the cruci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C14/12C23C14/24H01L51/56
CPCC23C14/24C23C14/12C23C14/042H10K71/166H10K71/00
Inventor 乔小平
Owner FUJIAN HUAJIACAI CO LTD