A wafer fragment analysis device and wafer fragment analysis method thereof

Abstract

The invention discloses a wafer fragment analysis device and a wafer fragment analysis method thereof. The wafer fragment analysis device includes: a fragment recorder with a circular groove, which can carry wafers. At least one visual module is arranged on the outer edge of the circular groove, the visual module includes a convex lens arranged on the upper edge of the circular groove, a plane mirror is arranged on the outer side of the convex lens, and the wafer fragment analysis The device also includes a tray module including a base and a tray. In the present invention, a 45° plane mirror is added outside the convex lens, and the enlarged image is projected to the visual area by using the reflection principle, and personnel can directly see the impact point in the visual area. The present invention can accurately judge the contact point that leads to the position of the fragments, can accurately improve the machine parts, save the idle time of the machine caused by finding the cause of the fragments and the verification time after improvement, increase the utilization rate of the machine, and increase the production capacity and save human resource costs.

Description

technical field [0001] The invention relates to the technical field of wafer fragment detection, in particular to a wafer fragment analysis device and a wafer fragment analysis method. Background technique [0002] In the semiconductor production process, the causes of fragmentation are mainly divided into two parts. The first part is physical stress breakage, such as: changes in the pick-and-place position of the robot arm, lift-off impact when lifting pins, abnormal extrusion of the piston, abnormal vacuum, etc. The second part of the reason: high and low temperature equipment (furnace tube equipment, photoresist removal equipment, wet etching machine), the short-term temperature difference of the wafer is large, and the thermal expansion and contraction cause the wafer to break. To sum up, the semiconductor manufacturing process is complex, the chip contacts the machine many times, and there are many physical contact points between the machine and the chip. Due to the dif...

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a wafer fragment analysis device and a wafer fragment analysis method thereof, which are used to solve the problem of inability to accurately determine the contact point leading to the fragment position in the prior art, and to search for fragments. The reason is more difficult, and the improvement of fragments will cause a waste of resources

Images