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Metal-clad laminate, metal foil with resin, and wiring board

A metal clad and metal foil technology, applied in the field of metal foil and wiring boards, can solve problems such as transmission loss

Active Publication Date: 2020-02-21
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it is known that these transmission losses are particularly likely to occur when high-frequency signals are transmitted to the wiring included in the wiring board.

Method used

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  • Metal-clad laminate, metal foil with resin, and wiring board
  • Metal-clad laminate, metal foil with resin, and wiring board
  • Metal-clad laminate, metal foil with resin, and wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1、3～20、 and comparative example 1～5

[0152] Each component used when preparing the resin composition in this Example is demonstrated.

[0153] (Polyphenylene ether copolymer: modified PPE)

[0154] Modified PPE1: modified polyphenylene ether (with the structure shown in formula (11), R 3 Be methyl, Y is dimethylmethylene (represented by formula (5) and R in formula (5) 9 and R 10 The modified polyphenylene ether compound that is a methyl group), the SA9000 manufactured by SABIC Innovative Plastics, the intrinsic viscosity (IV) in methylene chloride at 25°C is 0.085dl / g, and the weight average molecular weight Mw1700, Number of terminal functional groups (also abbreviated as "functional group number" in Table 1 and Table 2) 1.8)

[0155] It should be noted that the aforementioned intrinsic viscosity is the viscosity obtained by measuring a 0.18 g / 45 ml methylene chloride solution (liquid temperature: 25° C.) of modified polyphenylene ether with a viscometer (AVS500 Visco System manufactured by SCHOTT Corporatio...

Embodiment 2

[0208] Example 2 is a resin-coated metal foil provided with an insulating adhesive layer (instead of an insulating layer) that does not contain a fibrous base material. Specifically, as the insulating adhesive layer does not contain a fibrous base material, the composition of the resin composition and the metal foil are as shown in Table 2, and the state of the semi-cured product before curing the above-mentioned resin composition is used, except that In the same manner as in Example 1, a resin-attached metal foil was produced. It should be noted that, when performing the following evaluations, the metal foil with resin obtained by further heating the metal foil with resin to cure the aforementioned resin composition (with a metal foil having an insulating layer obtained by curing the aforementioned insulating adhesive layer) was used. metal foil with resin).

[0209] Each of the metal foil-clad laminates or resin-coated metal foils prepared in the above manner was evaluated ...

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Abstract

A metal-clad laminate which is provided with an insulating layer and a metal foil that is in contact with at least one surface of the insulating layer, and wherein: the insulating layer contains a cured product of a resin composition that contains a polyphenylene ether copolymer which has an intrinsic viscosity of 0.03-0.12 dl / g as determined in methylene chloride at 25 DEG C, while having a specific group at a molecular end with an average of 1.5-3 groups per molecule, a thermosetting curing agent which has two or more carbon-carbon unsaturated double bonds at a molecular end, and a thermoplastic elastomer; the metal foil comprises a metal base material and a barrier layer which contains cobalt and is provided at least on a contact surface of the metal base material, said contact surfacebeing in contact with the insulating layer; and the contact surface has a surface roughness, namely, a ten-point average roughness Rz of 2 [mu]m or less.

Description

technical field [0001] The present invention relates to a metal foil-clad laminate, a resin-coated metal foil and a wiring board. Background technique [0002] In various electronic devices, as the amount of information processing increases, mounting technologies such as higher integration of mounted semiconductor devices, higher density of wiring, and multilayering are developing rapidly. In addition, as wiring boards used in various electronic devices, for example, wiring boards compatible with high frequencies, such as millimeter-wave radar boards used in automotive applications, are also required. [0003] When a signal is transmitted to the wiring included in the wiring board, transmission loss due to conductors forming the wiring, transmission loss due to dielectrics around the wiring, and the like occur. For wiring boards, in order to increase the transmission speed of signals, it is required to reduce the loss during signal transmission. In addition, it is known th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B27/00B32B27/26C08F290/06H05K1/03H05K1/09
CPCC08F290/06H05K1/0366H05K1/0373H05K1/0353H05K3/388H05K3/389H05K2201/0209H05K3/022B32B2307/748B32B2457/08B32B2250/40B32B5/26B32B2307/54B32B2260/021B32B2307/732B32B29/005B32B2255/205B32B2262/0276B32B2307/204B32B2262/0269B32B15/20B32B2307/206B32B15/14B32B5/022B32B2307/538B32B2260/046B32B2255/06B32B2262/101B32B15/12H05K1/0326B32B5/024B32B15/06B32B15/08H05K1/09
Inventor 津田康介斋藤宏典藤原弘明
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD