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Optical image capturing module

An optical imaging and imaging surface technology, applied in optics, optical components, image communication, etc., can solve the problem that the size and imaging quality cannot meet the requirements of photography, and achieve the effect of improving the relative illuminance

Active Publication Date: 2020-02-25
ABILITY OPTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]The optical system traditionally mounted on portable devices, due to the continuous development of portable devices in the direction of pixel enhancement, and the increasing demand of end consumers for large apertures, such as micro Light and night shooting functions, the size and imaging quality of existing optical imaging modules can no longer meet higher-level photography requirements

Method used

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Embodiment Construction

[0110] The main design content of the optical imaging module includes structural implementation design and optical implementation design. The following will first explain the relevant content of the structural embodiment:

[0111] Please refer to Figure 1A , the optical imaging module of the first preferred structural embodiment of the present invention mainly includes a circuit element and a lens element. The circuit element includes an image sensing element S and a circuit substrate EB, the outer peripheral edge of the image sensing element S and the maximum value of the minimum side length on a plane perpendicular to the optical axis is LS, and the image sensing element S In this embodiment, it is fixed on the circuit substrate EB in a COB (Chip On Board) package. More specifically, the circuit substrate EB has a plurality of circuit contacts EP, and the image sensing element has a first surface S1 and a second surface S2, the first surface S1 is connected to the circuit s...

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Abstract

An optical image capturing module includes a lens assembly and a circuit assembly including a circuit substrate and an image sensing component electrically connected to the circuit substrate via signal transmission elements. The lens assembly includes a fixed base disposed on the circuit substrate, a movable base, and a lens group. The fixed base made of an opaque material has a focusing hole penetrating through two ends of the fixed base to be hollow, and is disposed on the circuit substrate, so the image sensing component is located in the focusing hole. The movable base disposed in the focusing hole could move relative to the fixed base. The lens group including at least two lenses having refractive power is disposed in a receiving hole of the movable base, thereby light could pass through the lens group and project onto a sensing surface of the image sensing component.

Description

technical field [0001] The present invention relates to an optical imaging module, and in particular to an optical imaging module applied to electronic products and capable of miniaturization. Background technique [0002] In recent years, with the rise of portable electronic products with photography functions, the demand for optical systems has increased day by day. The photosensitive element of the general optical system is nothing more than two types of photosensitive coupling device (Charge Coupled Device; CCD) or complementary metal oxide semiconductor element (Complementary Metal-Oxide Semiconductor Sensor; CMOSSensor), and with the progress of semiconductor process technology, making The pixel size of the photosensitive element is reduced, and the optical system is gradually developing towards a high-pixel direction, so the requirements for image quality are also increasing. [0003] The optical system traditionally mounted on portable devices, due to the continuous...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B7/00G02B7/02G02B13/00G02B13/18G03B17/12H04N5/225
CPCG02B13/004G02B13/0045G02B13/18G02B7/022G02B7/025G02B7/006G03B17/12H04N23/50H04N23/57H04N23/55H04N23/54G02B7/021G02B13/0035H01L27/14618H01L27/14625G02B5/208G02B9/62G02B9/64G02B9/34G02B9/16H01L27/14636G02B9/60
Inventor 张永明赖建勋刘燿维
Owner ABILITY OPTO ELECTRONICS TECH