Active cooling computer memory stick sheath

A memory stick, active technology, applied in computing, instruments, electrical and digital data processing, etc., can solve the problems affecting the connection between memory sticks and motherboards, the computer cannot work normally, and the heat dissipation efficiency is not high, so as to avoid machine running lags, The effect of increasing practicality and saving energy consumption

Active Publication Date: 2022-05-17
HUNAN UNIV OF SCI & ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The proportion of memory with jackets has increased, but a large amount of memory is still in the streaking mode. As we all know, computer memory sticks are installed bare on the motherboard in the computer case
[0003] Due to the installation location, the computer memory sticks are generally facing the cooling fan in the chassis, because the memory sticks will generate a lot of heat when they work, and the cooling fan is needed to dissipate heat. Not only the heat dissipation efficiency is not high, the effect is not good, and the dust is also absorbed Blowing, accumulated on the memory stick and in the connection gap between the memory stick and the motherboard, this will affect the connection between the memory stick and the motherboard after a long time, causing the computer to not work normally

Method used

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  • Active cooling computer memory stick sheath
  • Active cooling computer memory stick sheath
  • Active cooling computer memory stick sheath

Examples

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] as attached Figure 1-8The shown active heat dissipation computer memory strip sheath includes a mainboard 1, a cooling installation plate 2 is fixedly installed on the top of the mainboard 1, and a condensation pipe 3 is installed inside the cooling installation plate 2, and a cooling installation plate 2 The top surface of the right-angled connecting card strip 4 is detachably installed, the inner surface of the right-angled connecting card bar 4 is f...

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Abstract

The invention discloses a novel active heat dissipation computer memory strip sheath, specifically relates to the technical field of computer memory strip sheaths, including a mainframe mainboard, a cooling installation plate is fixedly installed on the top of the mainframe mainboard, and a cooling installation plate is installed inside the cooling installation plate. Condenser pipe, the top surface of the cooling installation plate is detachably installed with a right-angle connection clip, the inner surface of the right-angle connection clip is fixedly connected with a sealed protective cover, and the middle part of the top surface of the cooling installation plate is fixedly installed with a memory socket. The present invention sets the temperature sensor, the temperature control adjustment cooling switch and the temperature control adjustment unit switch, senses and detects the temperature on the surface of the memory stick and its surroundings through the temperature sensor, and starts the operation through the temperature control adjustment unit switch when the temperature does not reach a certain critical value. The temperature-controlled heat dissipation unit drives the external airflow for one-stage cooling. When the temperature reaches above the critical value, the micro booster pump is activated through the central control processor and the temperature control to adjust the cooling switch.

Description

technical field [0001] The invention relates to the technical field of computer memory stick sheaths, and more specifically, the invention relates to an active heat dissipation computer memory stick sheath. Background technique [0002] With the rapid development of computer technology, memory modules are also rapidly updating. The memory capacity is not only based on G technology, as far as the memory stick itself is concerned, the frequency has also increased a lot. The proportion of memory with jackets has increased, but a large amount of memory is still in the streaking mode. As we all know, computer memory sticks are installed bare on the motherboard in the computer case. [0003] Due to the installation location, the computer memory sticks are generally facing the cooling fan in the chassis, because the memory sticks will generate a lot of heat when they work, and the cooling fan is needed to dissipate heat. If it blows, it will accumulate on the memory stick and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 杨杰杨环俊徐晓罗惠惠陈佩梁溢文刘小兵
Owner HUNAN UNIV OF SCI & ENG
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